thermal/x86_pkg_temp_thermal: Support multi-die/package

Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <[e-mail]>
Signed-off-by: Len Brown <[e-mail]>
Signed-off-by: Thomas Gleixner <[e-mail]>
Reviewed-by: Ingo Molnar <[e-mail]>
Acked-by: Peter Zijlstra (Intel) <[e-mail]>
Link: https://lkml.kernel.org/r/2[e-mail]

drivers/thermal/intel/x86_pkg_temp_thermal.c

···
  */
 static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 
 	if (pkgid >= 0 && pkgid < max_packages)
 		return packages[pkgid];
···
 
 static int pkg_temp_thermal_device_add(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 	u32 tj_max, eax, ebx, ecx, edx;
 	struct pkg_device *pkgdev;
 	int thres_count, err;
···
 	 * worker will see the package anymore.
 	 */
 	if (lastcpu) {
-		packages[topology_logical_package_id(cpu)] = NULL;
+		packages[topology_logical_die_id(cpu)] = NULL;
 		/* After this point nothing touches the MSR anymore. */
 		wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
 		      pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
···
 	if (!x86_match_cpu(pkg_temp_thermal_ids))
 		return -ENODEV;
 
-	max_packages = topology_max_packages();
+	max_packages = topology_max_packages() * topology_max_die_per_package();
 	packages = kcalloc(max_packages, sizeof(struct pkg_device *),
 			   GFP_KERNEL);
 	if (!packages)