powercap/intel_rapl: Support multi-die/package

RAPL "package" domains are actually implemented in hardware per-die.
Thus, the new multi-die/package systems have mulitple domains
within each physical package.

Update the intel_rapl driver to be "die aware" -- exporting multiple
domains within a single package, when present. No change on single
die/package systems.

Signed-off-by: Zhang Rui <[e-mail]>
Signed-off-by: Len Brown <[e-mail]>
Signed-off-by: Thomas Gleixner <[e-mail]>
Reviewed-by: Ingo Molnar <[e-mail]>
Acked-by: Rafael J. Wysocki <[e-mail]>
Acked-by: Peter Zijlstra (Intel) <[e-mail]>
Cc: [e-mail]
Link: https://lkml.kernel.org/r/9[e-mail]

drivers/powercap/intel_rapl.c

···
 /* caller to ensure CPU hotplug lock is held */
 static struct rapl_package *rapl_find_package_domain(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 
 	list_for_each_entry(rp, &rapl_packages, plist) {
···
 /* called from CPU hotplug notifier, hotplug lock held */
 static struct rapl_package *rapl_add_package(int cpu)
 {
-	int id = topology_physical_package_id(cpu);
+	int id = topology_logical_die_id(cpu);
 	struct rapl_package *rp;
 	int ret;