hwmon/coretemp: Support multi-die/package

Package temperature sensors are actually implemented in hardware per-die.

Update coretemp to be "die-aware", so it can expose mulitple sensors per
package, instead of just one. No change to single-die/package systems.

Signed-off-by: Zhang Rui <[e-mail]>
Signed-off-by: Len Brown <[e-mail]>
Signed-off-by: Thomas Gleixner <[e-mail]>
Reviewed-by: Ingo Molnar <[e-mail]>
Acked-by: Guenter Roeck <[e-mail]>
Acked-by: Peter Zijlstra (Intel) <[e-mail]>
Cc: [e-mail]
Cc: [e-mail]
Link: https://lkml.kernel.org/r/e[e-mail]

drivers/hwmon/coretemp.c

···
 
 static struct platform_device *coretemp_get_pdev(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 
 	if (pkgid >= 0 && pkgid < max_packages)
 		return pkg_devices[pkgid];
···
 
 static struct platform_device *coretemp_device_add(unsigned int cpu)
 {
-	int err, pkgid = topology_logical_package_id(cpu);
+	int err, pkgid = topology_logical_die_id(cpu);
 	struct platform_device *pdev;
 
 	if (pkgid < 0)
···
 	 * the rest.
 	 */
 	if (cpumask_empty(&pd->cpumask)) {
-		pkg_devices[topology_logical_package_id(cpu)] = NULL;
+		pkg_devices[topology_logical_die_id(cpu)] = NULL;
 		platform_device_unregister(pdev);
 		return 0;
 	}
···
 	if (!x86_match_cpu(coretemp_ids))
 		return -ENODEV;
 
-	max_packages = topology_max_packages();
+	max_packages = topology_max_packages() * topology_max_die_per_package();
 	pkg_devices = kcalloc(max_packages, sizeof(struct platform_device *),
 			      GFP_KERNEL);
 	if (!pkg_devices)