Linux kernel mirror (for testing) git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git
kernel os linux

thermal: introduce device tree parser

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

+1518 -3
+595
Documentation/devicetree/bindings/thermal/thermal.txt
··· 1 + * Thermal Framework Device Tree descriptor 2 + 3 + This file describes a generic binding to provide a way of 4 + defining hardware thermal structure using device tree. 5 + A thermal structure includes thermal zones and their components, 6 + such as trip points, polling intervals, sensors and cooling devices 7 + binding descriptors. 8 + 9 + The target of device tree thermal descriptors is to describe only 10 + the hardware thermal aspects. The thermal device tree bindings are 11 + not about how the system must control or which algorithm or policy 12 + must be taken in place. 13 + 14 + There are five types of nodes involved to describe thermal bindings: 15 + - thermal sensors: devices which may be used to take temperature 16 + measurements. 17 + - cooling devices: devices which may be used to dissipate heat. 18 + - trip points: describe key temperatures at which cooling is recommended. The 19 + set of points should be chosen based on hardware limits. 20 + - cooling maps: used to describe links between trip points and cooling devices; 21 + - thermal zones: used to describe thermal data within the hardware; 22 + 23 + The following is a description of each of these node types. 24 + 25 + * Thermal sensor devices 26 + 27 + Thermal sensor devices are nodes providing temperature sensing capabilities on 28 + thermal zones. Typical devices are I2C ADC converters and bandgaps. These are 29 + nodes providing temperature data to thermal zones. Thermal sensor devices may 30 + control one or more internal sensors. 31 + 32 + Required property: 33 + - #thermal-sensor-cells: Used to provide sensor device specific information 34 + Type: unsigned while referring to it. Typically 0 on thermal sensor 35 + Size: one cell nodes with only one sensor, and at least 1 on nodes 36 + with several internal sensors, in order 37 + to identify uniquely the sensor instances within 38 + the IC. See thermal zone binding for more details 39 + on how consumers refer to sensor devices. 40 + 41 + * Cooling device nodes 42 + 43 + Cooling devices are nodes providing control on power dissipation. There 44 + are essentially two ways to provide control on power dissipation. First 45 + is by means of regulating device performance, which is known as passive 46 + cooling. A typical passive cooling is a CPU that has dynamic voltage and 47 + frequency scaling (DVFS), and uses lower frequencies as cooling states. 48 + Second is by means of activating devices in order to remove 49 + the dissipated heat, which is known as active cooling, e.g. regulating 50 + fan speeds. In both cases, cooling devices shall have a way to determine 51 + the state of cooling in which the device is. 52 + 53 + Any cooling device has a range of cooling states (i.e. different levels 54 + of heat dissipation). For example a fan's cooling states correspond to 55 + the different fan speeds possible. Cooling states are referred to by 56 + single unsigned integers, where larger numbers mean greater heat 57 + dissipation. The precise set of cooling states associated with a device 58 + (as referred to be the cooling-min-state and cooling-max-state 59 + properties) should be defined in a particular device's binding. 60 + For more examples of cooling devices, refer to the example sections below. 61 + 62 + Required properties: 63 + - cooling-min-state: An integer indicating the smallest 64 + Type: unsigned cooling state accepted. Typically 0. 65 + Size: one cell 66 + 67 + - cooling-max-state: An integer indicating the largest 68 + Type: unsigned cooling state accepted. 69 + Size: one cell 70 + 71 + - #cooling-cells: Used to provide cooling device specific information 72 + Type: unsigned while referring to it. Must be at least 2, in order 73 + Size: one cell to specify minimum and maximum cooling state used 74 + in the reference. The first cell is the minimum 75 + cooling state requested and the second cell is 76 + the maximum cooling state requested in the reference. 77 + See Cooling device maps section below for more details 78 + on how consumers refer to cooling devices. 79 + 80 + * Trip points 81 + 82 + The trip node is a node to describe a point in the temperature domain 83 + in which the system takes an action. This node describes just the point, 84 + not the action. 85 + 86 + Required properties: 87 + - temperature: An integer indicating the trip temperature level, 88 + Type: signed in millicelsius. 89 + Size: one cell 90 + 91 + - hysteresis: A low hysteresis value on temperature property (above). 92 + Type: unsigned This is a relative value, in millicelsius. 93 + Size: one cell 94 + 95 + - type: a string containing the trip type. Expected values are: 96 + "active": A trip point to enable active cooling 97 + "passive": A trip point to enable passive cooling 98 + "hot": A trip point to notify emergency 99 + "critical": Hardware not reliable. 100 + Type: string 101 + 102 + * Cooling device maps 103 + 104 + The cooling device maps node is a node to describe how cooling devices 105 + get assigned to trip points of the zone. The cooling devices are expected 106 + to be loaded in the target system. 107 + 108 + Required properties: 109 + - cooling-device: A phandle of a cooling device with its specifier, 110 + Type: phandle + referring to which cooling device is used in this 111 + cooling specifier binding. In the cooling specifier, the first cell 112 + is the minimum cooling state and the second cell 113 + is the maximum cooling state used in this map. 114 + - trip: A phandle of a trip point node within the same thermal 115 + Type: phandle of zone. 116 + trip point node 117 + 118 + Optional property: 119 + - contribution: The cooling contribution to the thermal zone of the 120 + Type: unsigned referred cooling device at the referred trip point. 121 + Size: one cell The contribution is a ratio of the sum 122 + of all cooling contributions within a thermal zone. 123 + 124 + Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle 125 + limit specifier means: 126 + (i) - minimum state allowed for minimum cooling state used in the reference. 127 + (ii) - maximum state allowed for maximum cooling state used in the reference. 128 + Refer to include/dt-bindings/thermal/thermal.h for definition of this constant. 129 + 130 + * Thermal zone nodes 131 + 132 + The thermal zone node is the node containing all the required info 133 + for describing a thermal zone, including its cooling device bindings. The 134 + thermal zone node must contain, apart from its own properties, one sub-node 135 + containing trip nodes and one sub-node containing all the zone cooling maps. 136 + 137 + Required properties: 138 + - polling-delay: The maximum number of milliseconds to wait between polls 139 + Type: unsigned when checking this thermal zone. 140 + Size: one cell 141 + 142 + - polling-delay-passive: The maximum number of milliseconds to wait 143 + Type: unsigned between polls when performing passive cooling. 144 + Size: one cell 145 + 146 + - thermal-sensors: A list of thermal sensor phandles and sensor specifier 147 + Type: list of used while monitoring the thermal zone. 148 + phandles + sensor 149 + specifier 150 + 151 + - trips: A sub-node which is a container of only trip point nodes 152 + Type: sub-node required to describe the thermal zone. 153 + 154 + - cooling-maps: A sub-node which is a container of only cooling device 155 + Type: sub-node map nodes, used to describe the relation between trips 156 + and cooling devices. 157 + 158 + Optional property: 159 + - coefficients: An array of integers (one signed cell) containing 160 + Type: array coefficients to compose a linear relation between 161 + Elem size: one cell the sensors listed in the thermal-sensors property. 162 + Elem type: signed Coefficients defaults to 1, in case this property 163 + is not specified. A simple linear polynomial is used: 164 + Z = c0 * x0 + c1 + x1 + ... + c(n-1) * x(n-1) + cn. 165 + 166 + The coefficients are ordered and they match with sensors 167 + by means of sensor ID. Additional coefficients are 168 + interpreted as constant offset. 169 + 170 + Note: The delay properties are bound to the maximum dT/dt (temperature 171 + derivative over time) in two situations for a thermal zone: 172 + (i) - when passive cooling is activated (polling-delay-passive); and 173 + (ii) - when the zone just needs to be monitored (polling-delay) or 174 + when active cooling is activated. 175 + 176 + The maximum dT/dt is highly bound to hardware power consumption and dissipation 177 + capability. The delays should be chosen to account for said max dT/dt, 178 + such that a device does not cross several trip boundaries unexpectedly 179 + between polls. Choosing the right polling delays shall avoid having the 180 + device in temperature ranges that may damage the silicon structures and 181 + reduce silicon lifetime. 182 + 183 + * The thermal-zones node 184 + 185 + The "thermal-zones" node is a container for all thermal zone nodes. It shall 186 + contain only sub-nodes describing thermal zones as in the section 187 + "Thermal zone nodes". The "thermal-zones" node appears under "/". 188 + 189 + * Examples 190 + 191 + Below are several examples on how to use thermal data descriptors 192 + using device tree bindings: 193 + 194 + (a) - CPU thermal zone 195 + 196 + The CPU thermal zone example below describes how to setup one thermal zone 197 + using one single sensor as temperature source and many cooling devices and 198 + power dissipation control sources. 199 + 200 + #include <dt-bindings/thermal/thermal.h> 201 + 202 + cpus { 203 + /* 204 + * Here is an example of describing a cooling device for a DVFS 205 + * capable CPU. The CPU node describes its four OPPs. 206 + * The cooling states possible are 0..3, and they are 207 + * used as OPP indexes. The minimum cooling state is 0, which means 208 + * all four OPPs can be available to the system. The maximum 209 + * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V) 210 + * can be available in the system. 211 + */ 212 + cpu0: cpu@0 { 213 + ... 214 + operating-points = < 215 + /* kHz uV */ 216 + 970000 1200000 217 + 792000 1100000 218 + 396000 950000 219 + 198000 850000 220 + >; 221 + cooling-min-state = <0>; 222 + cooling-max-state = <3>; 223 + #cooling-cells = <2>; /* min followed by max */ 224 + }; 225 + ... 226 + }; 227 + 228 + &i2c1 { 229 + ... 230 + /* 231 + * A simple fan controller which supports 10 speeds of operation 232 + * (represented as 0-9). 233 + */ 234 + fan0: fan@0x48 { 235 + ... 236 + cooling-min-state = <0>; 237 + cooling-max-state = <9>; 238 + #cooling-cells = <2>; /* min followed by max */ 239 + }; 240 + }; 241 + 242 + ocp { 243 + ... 244 + /* 245 + * A simple IC with a single bandgap temperature sensor. 246 + */ 247 + bandgap0: bandgap@0x0000ED00 { 248 + ... 249 + #thermal-sensor-cells = <0>; 250 + }; 251 + }; 252 + 253 + thermal-zones { 254 + cpu-thermal: cpu-thermal { 255 + polling-delay-passive = <250>; /* milliseconds */ 256 + polling-delay = <1000>; /* milliseconds */ 257 + 258 + thermal-sensors = <&bandgap0>; 259 + 260 + trips { 261 + cpu-alert0: cpu-alert { 262 + temperature = <90000>; /* millicelsius */ 263 + hysteresis = <2000>; /* millicelsius */ 264 + type = "active"; 265 + }; 266 + cpu-alert1: cpu-alert { 267 + temperature = <100000>; /* millicelsius */ 268 + hysteresis = <2000>; /* millicelsius */ 269 + type = "passive"; 270 + }; 271 + cpu-crit: cpu-crit { 272 + temperature = <125000>; /* millicelsius */ 273 + hysteresis = <2000>; /* millicelsius */ 274 + type = "critical"; 275 + }; 276 + }; 277 + 278 + cooling-maps { 279 + map0 { 280 + trip = <&cpu-alert0>; 281 + cooling-device = <&fan0 THERMAL_NO_LIMITS 4>; 282 + }; 283 + map1 { 284 + trip = <&cpu-alert1>; 285 + cooling-device = <&fan0 5 THERMAL_NO_LIMITS>; 286 + }; 287 + map2 { 288 + trip = <&cpu-alert1>; 289 + cooling-device = 290 + <&cpu0 THERMAL_NO_LIMITS THERMAL_NO_LIMITS>; 291 + }; 292 + }; 293 + }; 294 + }; 295 + 296 + In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is 297 + used to monitor the zone 'cpu-thermal' using its sole sensor. A fan 298 + device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten 299 + different cooling states 0-9. It is used to remove the heat out of 300 + the thermal zone 'cpu-thermal' using its cooling states 301 + from its minimum to 4, when it reaches trip point 'cpu-alert0' 302 + at 90C, as an example of active cooling. The same cooling device is used at 303 + 'cpu-alert1', but from 5 to its maximum state. The cpu@0 device is also 304 + linked to the same thermal zone, 'cpu-thermal', as a passive cooling device, 305 + using all its cooling states at trip point 'cpu-alert1', 306 + which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the 307 + temperature of 125C, represented by the trip point 'cpu-crit', the silicon 308 + is not reliable anymore. 309 + 310 + (b) - IC with several internal sensors 311 + 312 + The example below describes how to deploy several thermal zones based off a 313 + single sensor IC, assuming it has several internal sensors. This is a common 314 + case on SoC designs with several internal IPs that may need different thermal 315 + requirements, and thus may have their own sensor to monitor or detect internal 316 + hotspots in their silicon. 317 + 318 + #include <dt-bindings/thermal/thermal.h> 319 + 320 + ocp { 321 + ... 322 + /* 323 + * A simple IC with several bandgap temperature sensors. 324 + */ 325 + bandgap0: bandgap@0x0000ED00 { 326 + ... 327 + #thermal-sensor-cells = <1>; 328 + }; 329 + }; 330 + 331 + thermal-zones { 332 + cpu-thermal: cpu-thermal { 333 + polling-delay-passive = <250>; /* milliseconds */ 334 + polling-delay = <1000>; /* milliseconds */ 335 + 336 + /* sensor ID */ 337 + thermal-sensors = <&bandgap0 0>; 338 + 339 + trips { 340 + /* each zone within the SoC may have its own trips */ 341 + cpu-alert: cpu-alert { 342 + temperature = <100000>; /* millicelsius */ 343 + hysteresis = <2000>; /* millicelsius */ 344 + type = "passive"; 345 + }; 346 + cpu-crit: cpu-crit { 347 + temperature = <125000>; /* millicelsius */ 348 + hysteresis = <2000>; /* millicelsius */ 349 + type = "critical"; 350 + }; 351 + }; 352 + 353 + cooling-maps { 354 + /* each zone within the SoC may have its own cooling */ 355 + ... 356 + }; 357 + }; 358 + 359 + gpu-thermal: gpu-thermal { 360 + polling-delay-passive = <120>; /* milliseconds */ 361 + polling-delay = <1000>; /* milliseconds */ 362 + 363 + /* sensor ID */ 364 + thermal-sensors = <&bandgap0 1>; 365 + 366 + trips { 367 + /* each zone within the SoC may have its own trips */ 368 + gpu-alert: gpu-alert { 369 + temperature = <90000>; /* millicelsius */ 370 + hysteresis = <2000>; /* millicelsius */ 371 + type = "passive"; 372 + }; 373 + gpu-crit: gpu-crit { 374 + temperature = <105000>; /* millicelsius */ 375 + hysteresis = <2000>; /* millicelsius */ 376 + type = "critical"; 377 + }; 378 + }; 379 + 380 + cooling-maps { 381 + /* each zone within the SoC may have its own cooling */ 382 + ... 383 + }; 384 + }; 385 + 386 + dsp-thermal: dsp-thermal { 387 + polling-delay-passive = <50>; /* milliseconds */ 388 + polling-delay = <1000>; /* milliseconds */ 389 + 390 + /* sensor ID */ 391 + thermal-sensors = <&bandgap0 2>; 392 + 393 + trips { 394 + /* each zone within the SoC may have its own trips */ 395 + dsp-alert: gpu-alert { 396 + temperature = <90000>; /* millicelsius */ 397 + hysteresis = <2000>; /* millicelsius */ 398 + type = "passive"; 399 + }; 400 + dsp-crit: gpu-crit { 401 + temperature = <135000>; /* millicelsius */ 402 + hysteresis = <2000>; /* millicelsius */ 403 + type = "critical"; 404 + }; 405 + }; 406 + 407 + cooling-maps { 408 + /* each zone within the SoC may have its own cooling */ 409 + ... 410 + }; 411 + }; 412 + }; 413 + 414 + In the example above, there is one bandgap IC which has the capability to 415 + monitor three sensors. The hardware has been designed so that sensors are 416 + placed on different places in the DIE to monitor different temperature 417 + hotspots: one for CPU thermal zone, one for GPU thermal zone and the 418 + other to monitor a DSP thermal zone. 419 + 420 + Thus, there is a need to assign each sensor provided by the bandgap IC 421 + to different thermal zones. This is achieved by means of using the 422 + #thermal-sensor-cells property and using the first cell of the sensor 423 + specifier as sensor ID. In the example, then, <bandgap 0> is used to 424 + monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal 425 + zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone 426 + may be uncorrelated, having its own dT/dt requirements, trips 427 + and cooling maps. 428 + 429 + 430 + (c) - Several sensors within one single thermal zone 431 + 432 + The example below illustrates how to use more than one sensor within 433 + one thermal zone. 434 + 435 + #include <dt-bindings/thermal/thermal.h> 436 + 437 + &i2c1 { 438 + ... 439 + /* 440 + * A simple IC with a single temperature sensor. 441 + */ 442 + adc: sensor@0x49 { 443 + ... 444 + #thermal-sensor-cells = <0>; 445 + }; 446 + }; 447 + 448 + ocp { 449 + ... 450 + /* 451 + * A simple IC with a single bandgap temperature sensor. 452 + */ 453 + bandgap0: bandgap@0x0000ED00 { 454 + ... 455 + #thermal-sensor-cells = <0>; 456 + }; 457 + }; 458 + 459 + thermal-zones { 460 + cpu-thermal: cpu-thermal { 461 + polling-delay-passive = <250>; /* milliseconds */ 462 + polling-delay = <1000>; /* milliseconds */ 463 + 464 + thermal-sensors = <&bandgap0>, /* cpu */ 465 + <&adc>; /* pcb north */ 466 + 467 + /* hotspot = 100 * bandgap - 120 * adc + 484 */ 468 + coefficients = <100 -120 484>; 469 + 470 + trips { 471 + ... 472 + }; 473 + 474 + cooling-maps { 475 + ... 476 + }; 477 + }; 478 + }; 479 + 480 + In some cases, there is a need to use more than one sensor to extrapolate 481 + a thermal hotspot in the silicon. The above example illustrates this situation. 482 + For instance, it may be the case that a sensor external to CPU IP may be placed 483 + close to CPU hotspot and together with internal CPU sensor, it is used 484 + to determine the hotspot. Assuming this is the case for the above example, 485 + the hypothetical extrapolation rule would be: 486 + hotspot = 100 * bandgap - 120 * adc + 484 487 + 488 + In other context, the same idea can be used to add fixed offset. For instance, 489 + consider the hotspot extrapolation rule below: 490 + hotspot = 1 * adc + 6000 491 + 492 + In the above equation, the hotspot is always 6C higher than what is read 493 + from the ADC sensor. The binding would be then: 494 + thermal-sensors = <&adc>; 495 + 496 + /* hotspot = 1 * adc + 6000 */ 497 + coefficients = <1 6000>; 498 + 499 + (d) - Board thermal 500 + 501 + The board thermal example below illustrates how to setup one thermal zone 502 + with many sensors and many cooling devices. 503 + 504 + #include <dt-bindings/thermal/thermal.h> 505 + 506 + &i2c1 { 507 + ... 508 + /* 509 + * An IC with several temperature sensor. 510 + */ 511 + adc-dummy: sensor@0x50 { 512 + ... 513 + #thermal-sensor-cells = <1>; /* sensor internal ID */ 514 + }; 515 + }; 516 + 517 + thermal-zones { 518 + batt-thermal { 519 + polling-delay-passive = <500>; /* milliseconds */ 520 + polling-delay = <2500>; /* milliseconds */ 521 + 522 + /* sensor ID */ 523 + thermal-sensors = <&adc-dummy 4>; 524 + 525 + trips { 526 + ... 527 + }; 528 + 529 + cooling-maps { 530 + ... 531 + }; 532 + }; 533 + 534 + board-thermal: board-thermal { 535 + polling-delay-passive = <1000>; /* milliseconds */ 536 + polling-delay = <2500>; /* milliseconds */ 537 + 538 + /* sensor ID */ 539 + thermal-sensors = <&adc-dummy 0>, /* pcb top edge */ 540 + <&adc-dummy 1>, /* lcd */ 541 + <&adc-dymmy 2>; /* back cover */ 542 + /* 543 + * An array of coefficients describing the sensor 544 + * linear relation. E.g.: 545 + * z = c1*x1 + c2*x2 + c3*x3 546 + */ 547 + coefficients = <1200 -345 890>; 548 + 549 + trips { 550 + /* Trips are based on resulting linear equation */ 551 + cpu-trip: cpu-trip { 552 + temperature = <60000>; /* millicelsius */ 553 + hysteresis = <2000>; /* millicelsius */ 554 + type = "passive"; 555 + }; 556 + gpu-trip: gpu-trip { 557 + temperature = <55000>; /* millicelsius */ 558 + hysteresis = <2000>; /* millicelsius */ 559 + type = "passive"; 560 + } 561 + lcd-trip: lcp-trip { 562 + temperature = <53000>; /* millicelsius */ 563 + hysteresis = <2000>; /* millicelsius */ 564 + type = "passive"; 565 + }; 566 + crit-trip: crit-trip { 567 + temperature = <68000>; /* millicelsius */ 568 + hysteresis = <2000>; /* millicelsius */ 569 + type = "critical"; 570 + }; 571 + }; 572 + 573 + cooling-maps { 574 + map0 { 575 + trip = <&cpu-trip>; 576 + cooling-device = <&cpu0 0 2>; 577 + contribution = <55>; 578 + }; 579 + map1 { 580 + trip = <&gpu-trip>; 581 + cooling-device = <&gpu0 0 2>; 582 + contribution = <20>; 583 + }; 584 + map2 { 585 + trip = <&lcd-trip>; 586 + cooling-device = <&lcd0 5 10>; 587 + contribution = <15>; 588 + }; 589 + }; 590 + }; 591 + }; 592 + 593 + The above example is a mix of previous examples, a sensor IP with several internal 594 + sensors used to monitor different zones, one of them is composed by several sensors and 595 + with different cooling devices.
+13
drivers/thermal/Kconfig
··· 29 29 Say 'Y' here if you want all thermal sensors to 30 30 have hwmon sysfs interface too. 31 31 32 + config THERMAL_OF 33 + bool 34 + prompt "APIs to parse thermal data out of device tree" 35 + depends on OF 36 + default y 37 + help 38 + This options provides helpers to add the support to 39 + read and parse thermal data definitions out of the 40 + device tree blob. 41 + 42 + Say 'Y' here if you need to build thermal infrastructure 43 + based on device tree. 44 + 32 45 choice 33 46 prompt "Default Thermal governor" 34 47 default THERMAL_DEFAULT_GOV_STEP_WISE
+1
drivers/thermal/Makefile
··· 7 7 8 8 # interface to/from other layers providing sensors 9 9 thermal_sys-$(CONFIG_THERMAL_HWMON) += thermal_hwmon.o 10 + thermal_sys-$(CONFIG_THERMAL_OF) += of-thermal.o 10 11 11 12 # governors 12 13 thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o
+849
drivers/thermal/of-thermal.c
··· 1 + /* 2 + * of-thermal.c - Generic Thermal Management device tree support. 3 + * 4 + * Copyright (C) 2013 Texas Instruments 5 + * Copyright (C) 2013 Eduardo Valentin <eduardo.valentin@ti.com> 6 + * 7 + * 8 + * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ 9 + * 10 + * This program is free software; you can redistribute it and/or modify 11 + * it under the terms of the GNU General Public License as published by 12 + * the Free Software Foundation; version 2 of the License. 13 + * 14 + * This program is distributed in the hope that it will be useful, but 15 + * WITHOUT ANY WARRANTY; without even the implied warranty of 16 + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU 17 + * General Public License for more details. 18 + * 19 + * You should have received a copy of the GNU General Public License along 20 + * with this program; if not, write to the Free Software Foundation, Inc., 21 + * 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA. 22 + * 23 + * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ 24 + */ 25 + #include <linux/thermal.h> 26 + #include <linux/slab.h> 27 + #include <linux/types.h> 28 + #include <linux/of_device.h> 29 + #include <linux/of_platform.h> 30 + #include <linux/err.h> 31 + #include <linux/export.h> 32 + #include <linux/string.h> 33 + 34 + #include "thermal_core.h" 35 + 36 + /*** Private data structures to represent thermal device tree data ***/ 37 + 38 + /** 39 + * struct __thermal_trip - representation of a point in temperature domain 40 + * @np: pointer to struct device_node that this trip point was created from 41 + * @temperature: temperature value in miliCelsius 42 + * @hysteresis: relative hysteresis in miliCelsius 43 + * @type: trip point type 44 + */ 45 + 46 + struct __thermal_trip { 47 + struct device_node *np; 48 + unsigned long int temperature; 49 + unsigned long int hysteresis; 50 + enum thermal_trip_type type; 51 + }; 52 + 53 + /** 54 + * struct __thermal_bind_param - a match between trip and cooling device 55 + * @cooling_device: a pointer to identify the referred cooling device 56 + * @trip_id: the trip point index 57 + * @usage: the percentage (from 0 to 100) of cooling contribution 58 + * @min: minimum cooling state used at this trip point 59 + * @max: maximum cooling state used at this trip point 60 + */ 61 + 62 + struct __thermal_bind_params { 63 + struct device_node *cooling_device; 64 + unsigned int trip_id; 65 + unsigned int usage; 66 + unsigned long min; 67 + unsigned long max; 68 + }; 69 + 70 + /** 71 + * struct __thermal_zone - internal representation of a thermal zone 72 + * @mode: current thermal zone device mode (enabled/disabled) 73 + * @passive_delay: polling interval while passive cooling is activated 74 + * @polling_delay: zone polling interval 75 + * @ntrips: number of trip points 76 + * @trips: an array of trip points (0..ntrips - 1) 77 + * @num_tbps: number of thermal bind params 78 + * @tbps: an array of thermal bind params (0..num_tbps - 1) 79 + * @sensor_data: sensor private data used while reading temperature and trend 80 + * @get_temp: sensor callback to read temperature 81 + * @get_trend: sensor callback to read temperature trend 82 + */ 83 + 84 + struct __thermal_zone { 85 + enum thermal_device_mode mode; 86 + int passive_delay; 87 + int polling_delay; 88 + 89 + /* trip data */ 90 + int ntrips; 91 + struct __thermal_trip *trips; 92 + 93 + /* cooling binding data */ 94 + int num_tbps; 95 + struct __thermal_bind_params *tbps; 96 + 97 + /* sensor interface */ 98 + void *sensor_data; 99 + int (*get_temp)(void *, long *); 100 + int (*get_trend)(void *, long *); 101 + }; 102 + 103 + /*** DT thermal zone device callbacks ***/ 104 + 105 + static int of_thermal_get_temp(struct thermal_zone_device *tz, 106 + unsigned long *temp) 107 + { 108 + struct __thermal_zone *data = tz->devdata; 109 + 110 + if (!data->get_temp) 111 + return -EINVAL; 112 + 113 + return data->get_temp(data->sensor_data, temp); 114 + } 115 + 116 + static int of_thermal_get_trend(struct thermal_zone_device *tz, int trip, 117 + enum thermal_trend *trend) 118 + { 119 + struct __thermal_zone *data = tz->devdata; 120 + long dev_trend; 121 + int r; 122 + 123 + if (!data->get_trend) 124 + return -EINVAL; 125 + 126 + r = data->get_trend(data->sensor_data, &dev_trend); 127 + if (r) 128 + return r; 129 + 130 + /* TODO: These intervals might have some thresholds, but in core code */ 131 + if (dev_trend > 0) 132 + *trend = THERMAL_TREND_RAISING; 133 + else if (dev_trend < 0) 134 + *trend = THERMAL_TREND_DROPPING; 135 + else 136 + *trend = THERMAL_TREND_STABLE; 137 + 138 + return 0; 139 + } 140 + 141 + static int of_thermal_bind(struct thermal_zone_device *thermal, 142 + struct thermal_cooling_device *cdev) 143 + { 144 + struct __thermal_zone *data = thermal->devdata; 145 + int i; 146 + 147 + if (!data || IS_ERR(data)) 148 + return -ENODEV; 149 + 150 + /* find where to bind */ 151 + for (i = 0; i < data->num_tbps; i++) { 152 + struct __thermal_bind_params *tbp = data->tbps + i; 153 + 154 + if (tbp->cooling_device == cdev->np) { 155 + int ret; 156 + 157 + ret = thermal_zone_bind_cooling_device(thermal, 158 + tbp->trip_id, cdev, 159 + tbp->min, 160 + tbp->max); 161 + if (ret) 162 + return ret; 163 + } 164 + } 165 + 166 + return 0; 167 + } 168 + 169 + static int of_thermal_unbind(struct thermal_zone_device *thermal, 170 + struct thermal_cooling_device *cdev) 171 + { 172 + struct __thermal_zone *data = thermal->devdata; 173 + int i; 174 + 175 + if (!data || IS_ERR(data)) 176 + return -ENODEV; 177 + 178 + /* find where to unbind */ 179 + for (i = 0; i < data->num_tbps; i++) { 180 + struct __thermal_bind_params *tbp = data->tbps + i; 181 + 182 + if (tbp->cooling_device == cdev->np) { 183 + int ret; 184 + 185 + ret = thermal_zone_unbind_cooling_device(thermal, 186 + tbp->trip_id, cdev); 187 + if (ret) 188 + return ret; 189 + } 190 + } 191 + 192 + return 0; 193 + } 194 + 195 + static int of_thermal_get_mode(struct thermal_zone_device *tz, 196 + enum thermal_device_mode *mode) 197 + { 198 + struct __thermal_zone *data = tz->devdata; 199 + 200 + *mode = data->mode; 201 + 202 + return 0; 203 + } 204 + 205 + static int of_thermal_set_mode(struct thermal_zone_device *tz, 206 + enum thermal_device_mode mode) 207 + { 208 + struct __thermal_zone *data = tz->devdata; 209 + 210 + mutex_lock(&tz->lock); 211 + 212 + if (mode == THERMAL_DEVICE_ENABLED) 213 + tz->polling_delay = data->polling_delay; 214 + else 215 + tz->polling_delay = 0; 216 + 217 + mutex_unlock(&tz->lock); 218 + 219 + data->mode = mode; 220 + thermal_zone_device_update(tz); 221 + 222 + return 0; 223 + } 224 + 225 + static int of_thermal_get_trip_type(struct thermal_zone_device *tz, int trip, 226 + enum thermal_trip_type *type) 227 + { 228 + struct __thermal_zone *data = tz->devdata; 229 + 230 + if (trip >= data->ntrips || trip < 0) 231 + return -EDOM; 232 + 233 + *type = data->trips[trip].type; 234 + 235 + return 0; 236 + } 237 + 238 + static int of_thermal_get_trip_temp(struct thermal_zone_device *tz, int trip, 239 + unsigned long *temp) 240 + { 241 + struct __thermal_zone *data = tz->devdata; 242 + 243 + if (trip >= data->ntrips || trip < 0) 244 + return -EDOM; 245 + 246 + *temp = data->trips[trip].temperature; 247 + 248 + return 0; 249 + } 250 + 251 + static int of_thermal_set_trip_temp(struct thermal_zone_device *tz, int trip, 252 + unsigned long temp) 253 + { 254 + struct __thermal_zone *data = tz->devdata; 255 + 256 + if (trip >= data->ntrips || trip < 0) 257 + return -EDOM; 258 + 259 + /* thermal framework should take care of data->mask & (1 << trip) */ 260 + data->trips[trip].temperature = temp; 261 + 262 + return 0; 263 + } 264 + 265 + static int of_thermal_get_trip_hyst(struct thermal_zone_device *tz, int trip, 266 + unsigned long *hyst) 267 + { 268 + struct __thermal_zone *data = tz->devdata; 269 + 270 + if (trip >= data->ntrips || trip < 0) 271 + return -EDOM; 272 + 273 + *hyst = data->trips[trip].hysteresis; 274 + 275 + return 0; 276 + } 277 + 278 + static int of_thermal_set_trip_hyst(struct thermal_zone_device *tz, int trip, 279 + unsigned long hyst) 280 + { 281 + struct __thermal_zone *data = tz->devdata; 282 + 283 + if (trip >= data->ntrips || trip < 0) 284 + return -EDOM; 285 + 286 + /* thermal framework should take care of data->mask & (1 << trip) */ 287 + data->trips[trip].hysteresis = hyst; 288 + 289 + return 0; 290 + } 291 + 292 + static int of_thermal_get_crit_temp(struct thermal_zone_device *tz, 293 + unsigned long *temp) 294 + { 295 + struct __thermal_zone *data = tz->devdata; 296 + int i; 297 + 298 + for (i = 0; i < data->ntrips; i++) 299 + if (data->trips[i].type == THERMAL_TRIP_CRITICAL) { 300 + *temp = data->trips[i].temperature; 301 + return 0; 302 + } 303 + 304 + return -EINVAL; 305 + } 306 + 307 + static struct thermal_zone_device_ops of_thermal_ops = { 308 + .get_mode = of_thermal_get_mode, 309 + .set_mode = of_thermal_set_mode, 310 + 311 + .get_trip_type = of_thermal_get_trip_type, 312 + .get_trip_temp = of_thermal_get_trip_temp, 313 + .set_trip_temp = of_thermal_set_trip_temp, 314 + .get_trip_hyst = of_thermal_get_trip_hyst, 315 + .set_trip_hyst = of_thermal_set_trip_hyst, 316 + .get_crit_temp = of_thermal_get_crit_temp, 317 + 318 + .bind = of_thermal_bind, 319 + .unbind = of_thermal_unbind, 320 + }; 321 + 322 + /*** sensor API ***/ 323 + 324 + static struct thermal_zone_device * 325 + thermal_zone_of_add_sensor(struct device_node *zone, 326 + struct device_node *sensor, void *data, 327 + int (*get_temp)(void *, long *), 328 + int (*get_trend)(void *, long *)) 329 + { 330 + struct thermal_zone_device *tzd; 331 + struct __thermal_zone *tz; 332 + 333 + tzd = thermal_zone_get_zone_by_name(zone->name); 334 + if (IS_ERR(tzd)) 335 + return ERR_PTR(-EPROBE_DEFER); 336 + 337 + tz = tzd->devdata; 338 + 339 + mutex_lock(&tzd->lock); 340 + tz->get_temp = get_temp; 341 + tz->get_trend = get_trend; 342 + tz->sensor_data = data; 343 + 344 + tzd->ops->get_temp = of_thermal_get_temp; 345 + tzd->ops->get_trend = of_thermal_get_trend; 346 + mutex_unlock(&tzd->lock); 347 + 348 + return tzd; 349 + } 350 + 351 + /** 352 + * thermal_zone_of_sensor_register - registers a sensor to a DT thermal zone 353 + * @dev: a valid struct device pointer of a sensor device. Must contain 354 + * a valid .of_node, for the sensor node. 355 + * @sensor_id: a sensor identifier, in case the sensor IP has more 356 + * than one sensors 357 + * @data: a private pointer (owned by the caller) that will be passed 358 + * back, when a temperature reading is needed. 359 + * @get_temp: a pointer to a function that reads the sensor temperature. 360 + * @get_trend: a pointer to a function that reads the sensor temperature trend. 361 + * 362 + * This function will search the list of thermal zones described in device 363 + * tree and look for the zone that refer to the sensor device pointed by 364 + * @dev->of_node as temperature providers. For the zone pointing to the 365 + * sensor node, the sensor will be added to the DT thermal zone device. 366 + * 367 + * The thermal zone temperature is provided by the @get_temp function 368 + * pointer. When called, it will have the private pointer @data back. 369 + * 370 + * The thermal zone temperature trend is provided by the @get_trend function 371 + * pointer. When called, it will have the private pointer @data back. 372 + * 373 + * TODO: 374 + * 01 - This function must enqueue the new sensor instead of using 375 + * it as the only source of temperature values. 376 + * 377 + * 02 - There must be a way to match the sensor with all thermal zones 378 + * that refer to it. 379 + * 380 + * Return: On success returns a valid struct thermal_zone_device, 381 + * otherwise, it returns a corresponding ERR_PTR(). Caller must 382 + * check the return value with help of IS_ERR() helper. 383 + */ 384 + struct thermal_zone_device * 385 + thermal_zone_of_sensor_register(struct device *dev, int sensor_id, 386 + void *data, int (*get_temp)(void *, long *), 387 + int (*get_trend)(void *, long *)) 388 + { 389 + struct device_node *np, *child, *sensor_np; 390 + 391 + np = of_find_node_by_name(NULL, "thermal-zones"); 392 + if (!np) 393 + return ERR_PTR(-ENODEV); 394 + 395 + if (!dev || !dev->of_node) 396 + return ERR_PTR(-EINVAL); 397 + 398 + sensor_np = dev->of_node; 399 + 400 + for_each_child_of_node(np, child) { 401 + struct of_phandle_args sensor_specs; 402 + int ret, id; 403 + 404 + /* For now, thermal framework supports only 1 sensor per zone */ 405 + ret = of_parse_phandle_with_args(child, "thermal-sensors", 406 + "#thermal-sensor-cells", 407 + 0, &sensor_specs); 408 + if (ret) 409 + continue; 410 + 411 + if (sensor_specs.args_count >= 1) { 412 + id = sensor_specs.args[0]; 413 + WARN(sensor_specs.args_count > 1, 414 + "%s: too many cells in sensor specifier %d\n", 415 + sensor_specs.np->name, sensor_specs.args_count); 416 + } else { 417 + id = 0; 418 + } 419 + 420 + if (sensor_specs.np == sensor_np && id == sensor_id) { 421 + of_node_put(np); 422 + return thermal_zone_of_add_sensor(child, sensor_np, 423 + data, 424 + get_temp, 425 + get_trend); 426 + } 427 + } 428 + of_node_put(np); 429 + 430 + return ERR_PTR(-ENODEV); 431 + } 432 + EXPORT_SYMBOL_GPL(thermal_zone_of_sensor_register); 433 + 434 + /** 435 + * thermal_zone_of_sensor_unregister - unregisters a sensor from a DT thermal zone 436 + * @dev: a valid struct device pointer of a sensor device. Must contain 437 + * a valid .of_node, for the sensor node. 438 + * @tzd: a pointer to struct thermal_zone_device where the sensor is registered. 439 + * 440 + * This function removes the sensor callbacks and private data from the 441 + * thermal zone device registered with thermal_zone_of_sensor_register() 442 + * API. It will also silent the zone by remove the .get_temp() and .get_trend() 443 + * thermal zone device callbacks. 444 + * 445 + * TODO: When the support to several sensors per zone is added, this 446 + * function must search the sensor list based on @dev parameter. 447 + * 448 + */ 449 + void thermal_zone_of_sensor_unregister(struct device *dev, 450 + struct thermal_zone_device *tzd) 451 + { 452 + struct __thermal_zone *tz; 453 + 454 + if (!dev || !tzd || !tzd->devdata) 455 + return; 456 + 457 + tz = tzd->devdata; 458 + 459 + /* no __thermal_zone, nothing to be done */ 460 + if (!tz) 461 + return; 462 + 463 + mutex_lock(&tzd->lock); 464 + tzd->ops->get_temp = NULL; 465 + tzd->ops->get_trend = NULL; 466 + 467 + tz->get_temp = NULL; 468 + tz->get_trend = NULL; 469 + tz->sensor_data = NULL; 470 + mutex_unlock(&tzd->lock); 471 + } 472 + EXPORT_SYMBOL_GPL(thermal_zone_of_sensor_unregister); 473 + 474 + /*** functions parsing device tree nodes ***/ 475 + 476 + /** 477 + * thermal_of_populate_bind_params - parse and fill cooling map data 478 + * @np: DT node containing a cooling-map node 479 + * @__tbp: data structure to be filled with cooling map info 480 + * @trips: array of thermal zone trip points 481 + * @ntrips: number of trip points inside trips. 482 + * 483 + * This function parses a cooling-map type of node represented by 484 + * @np parameter and fills the read data into @__tbp data structure. 485 + * It needs the already parsed array of trip points of the thermal zone 486 + * in consideration. 487 + * 488 + * Return: 0 on success, proper error code otherwise 489 + */ 490 + static int thermal_of_populate_bind_params(struct device_node *np, 491 + struct __thermal_bind_params *__tbp, 492 + struct __thermal_trip *trips, 493 + int ntrips) 494 + { 495 + struct of_phandle_args cooling_spec; 496 + struct device_node *trip; 497 + int ret, i; 498 + u32 prop; 499 + 500 + /* Default weight. Usage is optional */ 501 + __tbp->usage = 0; 502 + ret = of_property_read_u32(np, "contribution", &prop); 503 + if (ret == 0) 504 + __tbp->usage = prop; 505 + 506 + trip = of_parse_phandle(np, "trip", 0); 507 + if (!trip) { 508 + pr_err("missing trip property\n"); 509 + return -ENODEV; 510 + } 511 + 512 + /* match using device_node */ 513 + for (i = 0; i < ntrips; i++) 514 + if (trip == trips[i].np) { 515 + __tbp->trip_id = i; 516 + break; 517 + } 518 + 519 + if (i == ntrips) { 520 + ret = -ENODEV; 521 + goto end; 522 + } 523 + 524 + ret = of_parse_phandle_with_args(np, "cooling-device", "#cooling-cells", 525 + 0, &cooling_spec); 526 + if (ret < 0) { 527 + pr_err("missing cooling_device property\n"); 528 + goto end; 529 + } 530 + __tbp->cooling_device = cooling_spec.np; 531 + if (cooling_spec.args_count >= 2) { /* at least min and max */ 532 + __tbp->min = cooling_spec.args[0]; 533 + __tbp->max = cooling_spec.args[1]; 534 + } else { 535 + pr_err("wrong reference to cooling device, missing limits\n"); 536 + } 537 + 538 + end: 539 + of_node_put(trip); 540 + 541 + return ret; 542 + } 543 + 544 + /** 545 + * It maps 'enum thermal_trip_type' found in include/linux/thermal.h 546 + * into the device tree binding of 'trip', property type. 547 + */ 548 + static const char * const trip_types[] = { 549 + [THERMAL_TRIP_ACTIVE] = "active", 550 + [THERMAL_TRIP_PASSIVE] = "passive", 551 + [THERMAL_TRIP_HOT] = "hot", 552 + [THERMAL_TRIP_CRITICAL] = "critical", 553 + }; 554 + 555 + /** 556 + * thermal_of_get_trip_type - Get phy mode for given device_node 557 + * @np: Pointer to the given device_node 558 + * @type: Pointer to resulting trip type 559 + * 560 + * The function gets trip type string from property 'type', 561 + * and store its index in trip_types table in @type, 562 + * 563 + * Return: 0 on success, or errno in error case. 564 + */ 565 + static int thermal_of_get_trip_type(struct device_node *np, 566 + enum thermal_trip_type *type) 567 + { 568 + const char *t; 569 + int err, i; 570 + 571 + err = of_property_read_string(np, "type", &t); 572 + if (err < 0) 573 + return err; 574 + 575 + for (i = 0; i < ARRAY_SIZE(trip_types); i++) 576 + if (!strcasecmp(t, trip_types[i])) { 577 + *type = i; 578 + return 0; 579 + } 580 + 581 + return -ENODEV; 582 + } 583 + 584 + /** 585 + * thermal_of_populate_trip - parse and fill one trip point data 586 + * @np: DT node containing a trip point node 587 + * @trip: trip point data structure to be filled up 588 + * 589 + * This function parses a trip point type of node represented by 590 + * @np parameter and fills the read data into @trip data structure. 591 + * 592 + * Return: 0 on success, proper error code otherwise 593 + */ 594 + static int thermal_of_populate_trip(struct device_node *np, 595 + struct __thermal_trip *trip) 596 + { 597 + int prop; 598 + int ret; 599 + 600 + ret = of_property_read_u32(np, "temperature", &prop); 601 + if (ret < 0) { 602 + pr_err("missing temperature property\n"); 603 + return ret; 604 + } 605 + trip->temperature = prop; 606 + 607 + ret = of_property_read_u32(np, "hysteresis", &prop); 608 + if (ret < 0) { 609 + pr_err("missing hysteresis property\n"); 610 + return ret; 611 + } 612 + trip->hysteresis = prop; 613 + 614 + ret = thermal_of_get_trip_type(np, &trip->type); 615 + if (ret < 0) { 616 + pr_err("wrong trip type property\n"); 617 + return ret; 618 + } 619 + 620 + /* Required for cooling map matching */ 621 + trip->np = np; 622 + 623 + return 0; 624 + } 625 + 626 + /** 627 + * thermal_of_build_thermal_zone - parse and fill one thermal zone data 628 + * @np: DT node containing a thermal zone node 629 + * 630 + * This function parses a thermal zone type of node represented by 631 + * @np parameter and fills the read data into a __thermal_zone data structure 632 + * and return this pointer. 633 + * 634 + * TODO: Missing properties to parse: thermal-sensor-names and coefficients 635 + * 636 + * Return: On success returns a valid struct __thermal_zone, 637 + * otherwise, it returns a corresponding ERR_PTR(). Caller must 638 + * check the return value with help of IS_ERR() helper. 639 + */ 640 + static struct __thermal_zone * 641 + thermal_of_build_thermal_zone(struct device_node *np) 642 + { 643 + struct device_node *child = NULL, *gchild; 644 + struct __thermal_zone *tz; 645 + int ret, i; 646 + u32 prop; 647 + 648 + if (!np) { 649 + pr_err("no thermal zone np\n"); 650 + return ERR_PTR(-EINVAL); 651 + } 652 + 653 + tz = kzalloc(sizeof(*tz), GFP_KERNEL); 654 + if (!tz) 655 + return ERR_PTR(-ENOMEM); 656 + 657 + ret = of_property_read_u32(np, "polling-delay-passive", &prop); 658 + if (ret < 0) { 659 + pr_err("missing polling-delay-passive property\n"); 660 + goto free_tz; 661 + } 662 + tz->passive_delay = prop; 663 + 664 + ret = of_property_read_u32(np, "polling-delay", &prop); 665 + if (ret < 0) { 666 + pr_err("missing polling-delay property\n"); 667 + goto free_tz; 668 + } 669 + tz->polling_delay = prop; 670 + 671 + /* trips */ 672 + child = of_get_child_by_name(np, "trips"); 673 + 674 + /* No trips provided */ 675 + if (!child) 676 + goto finish; 677 + 678 + tz->ntrips = of_get_child_count(child); 679 + if (tz->ntrips == 0) /* must have at least one child */ 680 + goto finish; 681 + 682 + tz->trips = kzalloc(tz->ntrips * sizeof(*tz->trips), GFP_KERNEL); 683 + if (!tz->trips) { 684 + ret = -ENOMEM; 685 + goto free_tz; 686 + } 687 + 688 + i = 0; 689 + for_each_child_of_node(child, gchild) { 690 + ret = thermal_of_populate_trip(gchild, &tz->trips[i++]); 691 + if (ret) 692 + goto free_trips; 693 + } 694 + 695 + of_node_put(child); 696 + 697 + /* cooling-maps */ 698 + child = of_get_child_by_name(np, "cooling-maps"); 699 + 700 + /* cooling-maps not provided */ 701 + if (!child) 702 + goto finish; 703 + 704 + tz->num_tbps = of_get_child_count(child); 705 + if (tz->num_tbps == 0) 706 + goto finish; 707 + 708 + tz->tbps = kzalloc(tz->num_tbps * sizeof(*tz->tbps), GFP_KERNEL); 709 + if (!tz->tbps) { 710 + ret = -ENOMEM; 711 + goto free_trips; 712 + } 713 + 714 + i = 0; 715 + for_each_child_of_node(child, gchild) 716 + ret = thermal_of_populate_bind_params(gchild, &tz->tbps[i++], 717 + tz->trips, tz->ntrips); 718 + if (ret) 719 + goto free_tbps; 720 + 721 + finish: 722 + of_node_put(child); 723 + tz->mode = THERMAL_DEVICE_DISABLED; 724 + 725 + return tz; 726 + 727 + free_tbps: 728 + kfree(tz->tbps); 729 + free_trips: 730 + kfree(tz->trips); 731 + free_tz: 732 + kfree(tz); 733 + of_node_put(child); 734 + 735 + return ERR_PTR(ret); 736 + } 737 + 738 + static inline void of_thermal_free_zone(struct __thermal_zone *tz) 739 + { 740 + kfree(tz->tbps); 741 + kfree(tz->trips); 742 + kfree(tz); 743 + } 744 + 745 + /** 746 + * of_parse_thermal_zones - parse device tree thermal data 747 + * 748 + * Initialization function that can be called by machine initialization 749 + * code to parse thermal data and populate the thermal framework 750 + * with hardware thermal zones info. This function only parses thermal zones. 751 + * Cooling devices and sensor devices nodes are supposed to be parsed 752 + * by their respective drivers. 753 + * 754 + * Return: 0 on success, proper error code otherwise 755 + * 756 + */ 757 + int __init of_parse_thermal_zones(void) 758 + { 759 + struct device_node *np, *child; 760 + struct __thermal_zone *tz; 761 + struct thermal_zone_device_ops *ops; 762 + 763 + np = of_find_node_by_name(NULL, "thermal-zones"); 764 + if (!np) { 765 + pr_debug("unable to find thermal zones\n"); 766 + return 0; /* Run successfully on systems without thermal DT */ 767 + } 768 + 769 + for_each_child_of_node(np, child) { 770 + struct thermal_zone_device *zone; 771 + struct thermal_zone_params *tzp; 772 + 773 + tz = thermal_of_build_thermal_zone(child); 774 + if (IS_ERR(tz)) { 775 + pr_err("failed to build thermal zone %s: %ld\n", 776 + child->name, 777 + PTR_ERR(tz)); 778 + continue; 779 + } 780 + 781 + ops = kmemdup(&of_thermal_ops, sizeof(*ops), GFP_KERNEL); 782 + if (!ops) 783 + goto exit_free; 784 + 785 + tzp = kzalloc(sizeof(*tzp), GFP_KERNEL); 786 + if (!tzp) { 787 + kfree(ops); 788 + goto exit_free; 789 + } 790 + 791 + /* No hwmon because there might be hwmon drivers registering */ 792 + tzp->no_hwmon = true; 793 + 794 + zone = thermal_zone_device_register(child->name, tz->ntrips, 795 + 0, tz, 796 + ops, tzp, 797 + tz->passive_delay, 798 + tz->polling_delay); 799 + if (IS_ERR(zone)) { 800 + pr_err("Failed to build %s zone %ld\n", child->name, 801 + PTR_ERR(zone)); 802 + kfree(tzp); 803 + kfree(ops); 804 + of_thermal_free_zone(tz); 805 + /* attempting to build remaining zones still */ 806 + } 807 + } 808 + 809 + return 0; 810 + 811 + exit_free: 812 + of_thermal_free_zone(tz); 813 + 814 + /* no memory available, so free what we have built */ 815 + of_thermal_destroy_zones(); 816 + 817 + return -ENOMEM; 818 + } 819 + 820 + /** 821 + * of_thermal_destroy_zones - remove all zones parsed and allocated resources 822 + * 823 + * Finds all zones parsed and added to the thermal framework and remove them 824 + * from the system, together with their resources. 825 + * 826 + */ 827 + void of_thermal_destroy_zones(void) 828 + { 829 + struct device_node *np, *child; 830 + 831 + np = of_find_node_by_name(NULL, "thermal-zones"); 832 + if (!np) { 833 + pr_err("unable to find thermal zones\n"); 834 + return; 835 + } 836 + 837 + for_each_child_of_node(np, child) { 838 + struct thermal_zone_device *zone; 839 + 840 + zone = thermal_zone_get_zone_by_name(child->name); 841 + if (IS_ERR(zone)) 842 + continue; 843 + 844 + thermal_zone_device_unregister(zone); 845 + kfree(zone->tzp); 846 + kfree(zone->ops); 847 + of_thermal_free_zone(zone->devdata); 848 + } 849 + }
+8 -1
drivers/thermal/thermal_core.c
··· 1373 1373 */ 1374 1374 struct thermal_zone_device *thermal_zone_device_register(const char *type, 1375 1375 int trips, int mask, void *devdata, 1376 - const struct thermal_zone_device_ops *ops, 1376 + struct thermal_zone_device_ops *ops, 1377 1377 const struct thermal_zone_params *tzp, 1378 1378 int passive_delay, int polling_delay) 1379 1379 { ··· 1746 1746 if (result) 1747 1747 goto unregister_class; 1748 1748 1749 + result = of_parse_thermal_zones(); 1750 + if (result) 1751 + goto exit_netlink; 1752 + 1749 1753 return 0; 1750 1754 1755 + exit_netlink: 1756 + genetlink_exit(); 1751 1757 unregister_governors: 1752 1758 thermal_unregister_governors(); 1753 1759 unregister_class: ··· 1769 1763 1770 1764 static void __exit thermal_exit(void) 1771 1765 { 1766 + of_thermal_destroy_zones(); 1772 1767 genetlink_exit(); 1773 1768 class_unregister(&thermal_class); 1774 1769 thermal_unregister_governors();
+9
drivers/thermal/thermal_core.h
··· 77 77 static inline void thermal_gov_user_space_unregister(void) {} 78 78 #endif /* CONFIG_THERMAL_GOV_USER_SPACE */ 79 79 80 + /* device tree support */ 81 + #ifdef CONFIG_THERMAL_OF 82 + int of_parse_thermal_zones(void); 83 + void of_thermal_destroy_zones(void); 84 + #else 85 + static inline int of_parse_thermal_zones(void) { return 0; } 86 + static inline void of_thermal_destroy_zones(void) { } 87 + #endif 88 + 80 89 #endif /* __THERMAL_CORE_H__ */
+17
include/dt-bindings/thermal/thermal.h
··· 1 + /* 2 + * This header provides constants for most thermal bindings. 3 + * 4 + * Copyright (C) 2013 Texas Instruments 5 + * Eduardo Valentin <eduardo.valentin@ti.com> 6 + * 7 + * GPLv2 only 8 + */ 9 + 10 + #ifndef _DT_BINDINGS_THERMAL_THERMAL_H 11 + #define _DT_BINDINGS_THERMAL_THERMAL_H 12 + 13 + /* On cooling devices upper and lower limits */ 14 + #define THERMAL_NO_LIMIT (-1UL) 15 + 16 + #endif 17 +
+26 -2
include/linux/thermal.h
··· 143 143 int id; 144 144 char type[THERMAL_NAME_LENGTH]; 145 145 struct device device; 146 + struct device_node *np; 146 147 void *devdata; 147 148 const struct thermal_cooling_device_ops *ops; 148 149 bool updated; /* true if the cooling device does not need update */ ··· 173 172 int emul_temperature; 174 173 int passive; 175 174 unsigned int forced_passive; 176 - const struct thermal_zone_device_ops *ops; 175 + struct thermal_zone_device_ops *ops; 177 176 const struct thermal_zone_params *tzp; 178 177 struct thermal_governor *governor; 179 178 struct list_head thermal_instances; ··· 243 242 }; 244 243 245 244 /* Function declarations */ 245 + #ifdef CONFIG_THERMAL_OF 246 + struct thermal_zone_device * 247 + thermal_zone_of_sensor_register(struct device *dev, int id, 248 + void *data, int (*get_temp)(void *, long *), 249 + int (*get_trend)(void *, long *)); 250 + void thermal_zone_of_sensor_unregister(struct device *dev, 251 + struct thermal_zone_device *tz); 252 + #else 253 + static inline struct thermal_zone_device * 254 + thermal_zone_of_sensor_register(struct device *dev, int id, 255 + void *data, int (*get_temp)(void *, long *), 256 + int (*get_trend)(void *, long *)) 257 + { 258 + return NULL; 259 + } 260 + 261 + static inline 262 + void thermal_zone_of_sensor_unregister(struct device *dev, 263 + struct thermal_zone_device *tz) 264 + { 265 + } 266 + 267 + #endif 246 268 struct thermal_zone_device *thermal_zone_device_register(const char *, int, int, 247 - void *, const struct thermal_zone_device_ops *, 269 + void *, struct thermal_zone_device_ops *, 248 270 const struct thermal_zone_params *, int, int); 249 271 void thermal_zone_device_unregister(struct thermal_zone_device *); 250 272