tjh.dev
Linux kernel mirror (for testing)
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linux
1# SPDX-License-Identifier: GPL-2.0-only
2#
3# Generic thermal drivers configuration
4#
5
6menuconfig THERMAL
7 bool "Thermal drivers"
8 help
9 Thermal drivers offer a generic mechanism for
10 thermal management. Usually it's made up of one or more thermal
11 zones and cooling devices.
12 Each thermal zone contains its own temperature, trip points,
13 and cooling devices.
14 All platforms with ACPI or Open Firmware thermal support can use
15 this driver.
16 If you want this support, you should say Y here.
17
18if THERMAL
19
20config THERMAL_NETLINK
21 bool "Thermal netlink management"
22 depends on NET
23 help
24 The thermal framework has a netlink interface to do thermal
25 zones discovery, temperature readings and events such as
26 trip point crossed, cooling device update or governor
27 change. It is recommended to enable the feature.
28
29config THERMAL_STATISTICS
30 bool "Thermal state transition statistics"
31 help
32 Export thermal state transition statistics information through sysfs.
33
34 If in doubt, say N.
35
36config THERMAL_DEBUGFS
37 bool "Thermal subsystem debug support"
38 depends on DEBUG_FS
39 help
40 Say Y to allow the thermal subsystem to collect diagnostic
41 information that can be accessed via debugfs.
42
43config THERMAL_CORE_TESTING
44 tristate "Thermal core testing facility"
45 depends on DEBUG_FS
46 help
47 Say Y to add a debugfs-based thermal core testing facility.
48 It allows test thermal zones to be created and populated
49 with trip points in order to exercise the thermal core
50 functionality in a controlled way.
51
52config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
53 int "Emergency poweroff delay in milli-seconds"
54 default 0
55 help
56 Thermal subsystem will issue a graceful shutdown when
57 critical temperatures are reached using orderly_poweroff(). In
58 case of failure of an orderly_poweroff(), the thermal emergency
59 poweroff kicks in after a delay has elapsed and shuts down the system.
60 This config is number of milliseconds to delay before emergency
61 poweroff kicks in. Similarly to the critical trip point,
62 the delay should be carefully profiled so as to give adequate
63 time for orderly_poweroff() to finish on regular execution.
64 If set to 0 emergency poweroff will not be supported.
65
66 In doubt, leave as 0.
67
68config THERMAL_HWMON
69 bool
70 prompt "Expose thermal sensors as hwmon device"
71 depends on HWMON=y || HWMON=THERMAL
72 default y
73 help
74 In case a sensor is registered with the thermal
75 framework, this option will also register it
76 as a hwmon. The sensor will then have the common
77 hwmon sysfs interface.
78
79 Say 'Y' here if you want all thermal sensors to
80 have hwmon sysfs interface too.
81
82config THERMAL_OF
83 bool
84 prompt "APIs to parse thermal data out of device tree"
85 depends on OF
86 default y
87 help
88 This options provides helpers to add the support to
89 read and parse thermal data definitions out of the
90 device tree blob.
91
92 Say 'Y' here if you need to build thermal infrastructure
93 based on device tree.
94
95choice
96 prompt "Default Thermal governor"
97 default THERMAL_DEFAULT_GOV_STEP_WISE
98 help
99 This option sets which thermal governor shall be loaded at
100 startup. If in doubt, select 'step_wise'.
101
102config THERMAL_DEFAULT_GOV_STEP_WISE
103 bool "step_wise"
104 select THERMAL_GOV_STEP_WISE
105 help
106 Use the step_wise governor as default. This throttles the
107 devices one step at a time.
108
109config THERMAL_DEFAULT_GOV_FAIR_SHARE
110 bool "fair_share"
111 select THERMAL_GOV_FAIR_SHARE
112 help
113 Use the fair_share governor as default. This throttles the
114 devices based on their 'contribution' to a zone. The
115 contribution should be provided through platform data.
116
117config THERMAL_DEFAULT_GOV_USER_SPACE
118 bool "user_space"
119 select THERMAL_GOV_USER_SPACE
120 help
121 The Userspace governor allows to get trip point crossed
122 notification from the kernel via uevents. It is recommended
123 to use the netlink interface instead which gives richer
124 information about the thermal framework events.
125
126config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
127 bool "power_allocator"
128 depends on THERMAL_GOV_POWER_ALLOCATOR
129 help
130 Select this if you want to control temperature based on
131 system and device power allocation. This governor can only
132 operate on cooling devices that implement the power API.
133
134config THERMAL_DEFAULT_GOV_BANG_BANG
135 bool "bang_bang"
136 depends on THERMAL_GOV_BANG_BANG
137 help
138 Use the bang_bang governor as default. This throttles the
139 devices one step at the time, taking into account the trip
140 point hysteresis.
141
142endchoice
143
144config THERMAL_GOV_FAIR_SHARE
145 bool "Fair-share thermal governor"
146 help
147 Enable this to manage platform thermals using fair-share governor.
148
149config THERMAL_GOV_STEP_WISE
150 bool "Step_wise thermal governor"
151 help
152 Enable this to manage platform thermals using a simple linear
153 governor.
154
155config THERMAL_GOV_BANG_BANG
156 bool "Bang Bang thermal governor"
157 default n
158 help
159 Enable this to manage platform thermals using bang bang governor.
160
161 Say 'Y' here if you want to use two point temperature regulation
162 used for fans without throttling. Some fan drivers depend on this
163 governor to be enabled (e.g. acerhdf).
164
165config THERMAL_GOV_USER_SPACE
166 bool "User_space thermal governor"
167 help
168 Enable this to let the user space manage the platform thermals.
169
170config THERMAL_GOV_POWER_ALLOCATOR
171 bool "Power allocator thermal governor"
172 depends on ENERGY_MODEL
173 help
174 Enable this to manage platform thermals by dynamically
175 allocating and limiting power to devices.
176
177config CPU_THERMAL
178 bool "Generic cpu cooling support"
179 depends on THERMAL_OF
180 help
181 Enable the CPU cooling features. If the system has no active
182 cooling device available, this option allows to use the CPU
183 as a cooling device.
184
185if CPU_THERMAL
186
187config CPU_FREQ_THERMAL
188 bool "CPU frequency cooling device"
189 depends on CPU_FREQ
190 default y
191 help
192 This implements the generic cpu cooling mechanism through frequency
193 reduction. An ACPI version of this already exists
194 (drivers/acpi/processor_thermal.c).
195 This will be useful for platforms using the generic thermal interface
196 and not the ACPI interface.
197
198config CPU_IDLE_THERMAL
199 bool "CPU idle cooling device"
200 depends on IDLE_INJECT
201 help
202 This implements the CPU cooling mechanism through
203 idle injection. This will throttle the CPU by injecting
204 idle cycle.
205endif
206
207config DEVFREQ_THERMAL
208 bool "Generic device cooling support"
209 depends on PM_DEVFREQ
210 depends on PM_OPP
211 help
212 This implements the generic devfreq cooling mechanism through
213 frequency reduction for devices using devfreq.
214
215 This will throttle the device by limiting the maximum allowed DVFS
216 frequency corresponding to the cooling level.
217
218 In order to use the power extensions of the cooling device,
219 devfreq should use the simple_ondemand governor.
220
221 If you want this support, you should say Y here.
222
223config PCIE_THERMAL
224 bool "PCIe cooling support"
225 depends on PCIEPORTBUS
226 help
227 This implements PCIe cooling mechanism through bandwidth reduction
228 for PCIe devices.
229
230 If you want this support, you should say Y here.
231
232config THERMAL_EMULATION
233 bool "Thermal emulation mode support"
234 help
235 Enable this option to make a emul_temp sysfs node in thermal zone
236 directory to support temperature emulation. With emulation sysfs node,
237 user can manually input temperature and test the different trip
238 threshold behaviour for simulation purpose.
239
240 WARNING: Be careful while enabling this option on production systems,
241 because userland can easily disable the thermal policy by simply
242 flooding this sysfs node with low temperature values.
243
244config THERMAL_MMIO
245 tristate "Generic Thermal MMIO driver"
246 depends on OF
247 depends on HAS_IOMEM
248 help
249 This option enables the generic thermal MMIO driver that will use
250 memory-mapped reads to get the temperature. Any HW/System that
251 allows temperature reading by a single memory-mapped reading, be it
252 register or shared memory, is a potential candidate to work with this
253 driver.
254
255config HISI_THERMAL
256 tristate "Hisilicon thermal driver"
257 depends on ARCH_HISI || COMPILE_TEST
258 depends on HAS_IOMEM
259 depends on OF
260 default ARCH_HISI
261 help
262 Enable this to plug hisilicon's thermal sensor driver into the Linux
263 thermal framework. cpufreq is used as the cooling device to throttle
264 CPUs when the passive trip is crossed.
265
266config IMX_THERMAL
267 tristate "Temperature sensor driver for Freescale i.MX SoCs"
268 depends on ARCH_MXC || COMPILE_TEST
269 depends on NVMEM || !NVMEM
270 depends on MFD_SYSCON
271 depends on OF
272 help
273 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
274 It supports one critical trip point and one passive trip point. The
275 cpufreq is used as the cooling device to throttle CPUs when the
276 passive trip is crossed.
277
278config IMX_SC_THERMAL
279 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
280 depends on IMX_SCU
281 depends on OF
282 help
283 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
284 system controller inside, Linux kernel has to communicate with system
285 controller via MU (message unit) IPC to get temperature from thermal
286 sensor. It supports one critical trip point and one
287 passive trip point for each thermal sensor.
288
289config IMX8MM_THERMAL
290 tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
291 depends on ARCH_MXC || COMPILE_TEST
292 depends on OF
293 help
294 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
295 It supports one critical trip point and one passive trip point. The
296 cpufreq is used as the cooling device to throttle CPUs when the passive
297 trip is crossed.
298
299config K3_THERMAL
300 tristate "Texas Instruments K3 thermal support"
301 depends on ARCH_K3 || COMPILE_TEST
302 help
303 If you say yes here you get thermal support for the Texas Instruments
304 K3 SoC family. The current chip supported is:
305 - AM654
306
307 This includes temperature reading functionality.
308
309config MAX77620_THERMAL
310 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
311 depends on MFD_MAX77620
312 depends on OF
313 help
314 Support for die junction temperature warning alarm for Maxim
315 Semiconductor PMIC MAX77620 device. Device generates two alarm
316 interrupts when PMIC die temperature cross the threshold of
317 120 degC and 140 degC.
318
319config QORIQ_THERMAL
320 tristate "QorIQ Thermal Monitoring Unit"
321 depends on THERMAL_OF && HAS_IOMEM
322 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
323 select REGMAP_MMIO
324 help
325 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
326 It supports one critical trip point and one passive trip point. The
327 cpufreq is used as the cooling device to throttle CPUs when the
328 passive trip is crossed.
329
330config AIROHA_THERMAL
331 tristate "Airoha thermal sensor driver"
332 depends on ARCH_AIROHA || COMPILE_TEST
333 depends on MFD_SYSCON
334 depends on OF
335 help
336 Enable this to plug the Airoha thermal sensor driver into the Linux
337 thermal framework.
338
339config SPEAR_THERMAL
340 tristate "SPEAr thermal sensor driver"
341 depends on PLAT_SPEAR || COMPILE_TEST
342 depends on HAS_IOMEM
343 depends on OF
344 help
345 Enable this to plug the SPEAr thermal sensor driver into the Linux
346 thermal framework.
347
348config SUN8I_THERMAL
349 tristate "Allwinner sun8i thermal driver"
350 depends on ARCH_SUNXI || COMPILE_TEST
351 depends on HAS_IOMEM
352 depends on NVMEM
353 depends on OF
354 depends on RESET_CONTROLLER
355 help
356 Support for the sun8i thermal sensor driver into the Linux thermal
357 framework.
358
359 To compile this driver as a module, choose M here: the
360 module will be called sun8i-thermal.
361
362config ROCKCHIP_THERMAL
363 tristate "Rockchip thermal driver"
364 depends on ARCH_ROCKCHIP || COMPILE_TEST
365 depends on RESET_CONTROLLER
366 depends on HAS_IOMEM
367 help
368 Rockchip thermal driver provides support for Temperature sensor
369 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
370 trip point. Cpufreq is used as the cooling device and will throttle
371 CPUs when the Temperature crosses the passive trip point.
372
373config KIRKWOOD_THERMAL
374 tristate "Temperature sensor on Marvell Kirkwood SoCs"
375 depends on MACH_KIRKWOOD || COMPILE_TEST
376 depends on HAS_IOMEM
377 depends on OF
378 help
379 Support for the Kirkwood thermal sensor driver into the Linux thermal
380 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
381
382config DOVE_THERMAL
383 tristate "Temperature sensor on Marvell Dove SoCs"
384 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
385 depends on HAS_IOMEM
386 depends on OF
387 help
388 Support for the Dove thermal sensor driver in the Linux thermal
389 framework.
390
391config DB8500_THERMAL
392 tristate "DB8500 thermal management"
393 depends on MFD_DB8500_PRCMU && OF
394 default y
395 help
396 Adds DB8500 thermal management implementation according to the thermal
397 management framework. A thermal zone with several trip points will be
398 created. Cooling devices can be bound to the trip points to cool this
399 thermal zone if trip points reached.
400
401config ARMADA_THERMAL
402 tristate "Marvell EBU Armada SoCs thermal management"
403 depends on ARCH_MVEBU || COMPILE_TEST
404 depends on HAS_IOMEM
405 depends on OF
406 help
407 Enable this option if you want to have support for thermal management
408 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
409
410config DA9062_THERMAL
411 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
412 depends on MFD_DA9062 || COMPILE_TEST
413 depends on OF
414 help
415 Enable this for the Dialog Semiconductor thermal sensor driver.
416 This will report PMIC junction over-temperature for one thermal trip
417 zone.
418 Compatible with the DA9062 and DA9061 PMICs.
419
420menu "Mediatek thermal drivers"
421depends on ARCH_MEDIATEK || COMPILE_TEST
422source "drivers/thermal/mediatek/Kconfig"
423endmenu
424
425config AMLOGIC_THERMAL
426 tristate "Amlogic Thermal Support"
427 default ARCH_MESON
428 depends on OF && ARCH_MESON
429 help
430 If you say yes here you get support for Amlogic Thermal
431 for G12 SoC Family.
432
433 This driver can also be built as a module. If so, the module will
434 be called amlogic_thermal.
435
436menu "Intel thermal drivers"
437depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
438source "drivers/thermal/intel/Kconfig"
439endmenu
440
441menu "Broadcom thermal drivers"
442depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
443 COMPILE_TEST
444source "drivers/thermal/broadcom/Kconfig"
445endmenu
446
447menu "Texas Instruments thermal drivers"
448depends on ARCH_HAS_BANDGAP || COMPILE_TEST
449depends on HAS_IOMEM
450source "drivers/thermal/ti-soc-thermal/Kconfig"
451endmenu
452
453menu "Samsung thermal drivers"
454depends on ARCH_EXYNOS || COMPILE_TEST
455source "drivers/thermal/samsung/Kconfig"
456endmenu
457
458menu "STMicroelectronics thermal drivers"
459depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF
460source "drivers/thermal/st/Kconfig"
461endmenu
462
463source "drivers/thermal/renesas/Kconfig"
464
465source "drivers/thermal/tegra/Kconfig"
466
467config GENERIC_ADC_THERMAL
468 tristate "Generic ADC based thermal sensor"
469 depends on IIO
470 help
471 This enabled a thermal sysfs driver for the temperature sensor
472 which is connected to the General Purpose ADC. The ADC channel
473 is read via IIO framework and the channel information is provided
474 to this driver. This driver reports the temperature by reading ADC
475 channel and converts it to temperature based on lookup table.
476
477menu "Qualcomm thermal drivers"
478depends on (ARCH_QCOM && OF) || COMPILE_TEST
479source "drivers/thermal/qcom/Kconfig"
480endmenu
481
482config UNIPHIER_THERMAL
483 tristate "Socionext UniPhier thermal driver"
484 depends on ARCH_UNIPHIER || COMPILE_TEST
485 depends on THERMAL_OF && MFD_SYSCON
486 help
487 Enable this to plug in UniPhier on-chip PVT thermal driver into the
488 thermal framework. The driver supports CPU thermal zone temperature
489 reporting and a couple of trip points.
490
491config SPRD_THERMAL
492 tristate "Temperature sensor on Spreadtrum SoCs"
493 depends on ARCH_SPRD || COMPILE_TEST
494 help
495 Support for the Spreadtrum thermal sensor driver in the Linux thermal
496 framework.
497
498config KHADAS_MCU_FAN_THERMAL
499 tristate "Khadas MCU controller FAN cooling support"
500 depends on OF
501 depends on MFD_KHADAS_MCU
502 select MFD_CORE
503 select REGMAP
504 help
505 If you say yes here you get support for the FAN controlled
506 by the Microcontroller found on the Khadas VIM boards.
507
508config LOONGSON2_THERMAL
509 tristate "Loongson-2 SoC series thermal driver"
510 depends on LOONGARCH || COMPILE_TEST
511 depends on OF
512 help
513 Support for Thermal driver found on Loongson-2 SoC series platforms.
514 The thermal driver realizes get_temp and set_trips function, which
515 are used to obtain the temperature of the current node and set the
516 temperature range to trigger the interrupt. When the input temperature
517 is higher than the high temperature threshold or lower than the low
518 temperature threshold, the interrupt will occur.
519
520endif