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1Generic Thermal Sysfs driver How To 2========================= 3 4Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com> 5 6Updated: 2 January 2008 7 8Copyright (c) 2008 Intel Corporation 9 10 110. Introduction 12 13The generic thermal sysfs provides a set of interfaces for thermal zone devices (sensors) 14and thermal cooling devices (fan, processor...) to register with the thermal management 15solution and to be a part of it. 16 17This how-to focuses on enabling new thermal zone and cooling devices to participate 18in thermal management. 19This solution is platform independent and any type of thermal zone devices and 20cooling devices should be able to make use of the infrastructure. 21 22The main task of the thermal sysfs driver is to expose thermal zone attributes as well 23as cooling device attributes to the user space. 24An intelligent thermal management application can make decisions based on inputs 25from thermal zone attributes (the current temperature and trip point temperature) 26and throttle appropriate devices. 27 28[0-*] denotes any positive number starting from 0 29[1-*] denotes any positive number starting from 1 30 311. thermal sysfs driver interface functions 32 331.1 thermal zone device interface 341.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, int trips, 35 void *devdata, struct thermal_zone_device_ops *ops) 36 37 This interface function adds a new thermal zone device (sensor) to 38 /sys/class/thermal folder as thermal_zone[0-*]. 39 It tries to bind all the thermal cooling devices registered at the same time. 40 41 name: the thermal zone name. 42 trips: the total number of trip points this thermal zone supports. 43 devdata: device private data 44 ops: thermal zone device call-backs. 45 .bind: bind the thermal zone device with a thermal cooling device. 46 .unbind: unbind the thermal zone device with a thermal cooling device. 47 .get_temp: get the current temperature of the thermal zone. 48 .get_mode: get the current mode (user/kernel) of the thermal zone. 49 "kernel" means thermal management is done in kernel. 50 "user" will prevent kernel thermal driver actions upon trip points 51 so that user applications can take charge of thermal management. 52 .set_mode: set the mode (user/kernel) of the thermal zone. 53 .get_trip_type: get the type of certain trip point. 54 .get_trip_temp: get the temperature above which the certain trip point 55 will be fired. 56 571.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) 58 59 This interface function removes the thermal zone device. 60 It deletes the corresponding entry form /sys/class/thermal folder and unbind all 61 the thermal cooling devices it uses. 62 631.2 thermal cooling device interface 641.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, 65 void *devdata, struct thermal_cooling_device_ops *) 66 67 This interface function adds a new thermal cooling device (fan/processor/...) to 68 /sys/class/thermal/ folder as cooling_device[0-*]. 69 It tries to bind itself to all the thermal zone devices register at the same time. 70 name: the cooling device name. 71 devdata: device private data. 72 ops: thermal cooling devices call-backs. 73 .get_max_state: get the Maximum throttle state of the cooling device. 74 .get_cur_state: get the Current throttle state of the cooling device. 75 .set_cur_state: set the Current throttle state of the cooling device. 76 771.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) 78 79 This interface function remove the thermal cooling device. 80 It deletes the corresponding entry form /sys/class/thermal folder and unbind 81 itself from all the thermal zone devices using it. 82 831.3 interface for binding a thermal zone device with a thermal cooling device 841.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, 85 int trip, struct thermal_cooling_device *cdev); 86 87 This interface function bind a thermal cooling device to the certain trip point 88 of a thermal zone device. 89 This function is usually called in the thermal zone device .bind callback. 90 tz: the thermal zone device 91 cdev: thermal cooling device 92 trip: indicates which trip point the cooling devices is associated with 93 in this thermal zone. 94 951.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, 96 int trip, struct thermal_cooling_device *cdev); 97 98 This interface function unbind a thermal cooling device from the certain trip point 99 of a thermal zone device. 100 This function is usually called in the thermal zone device .unbind callback. 101 tz: the thermal zone device 102 cdev: thermal cooling device 103 trip: indicates which trip point the cooling devices is associated with 104 in this thermal zone. 105 1062. sysfs attributes structure 107 108RO read only value 109RW read/write value 110 111All thermal sysfs attributes will be represented under /sys/class/thermal 112 113Thermal zone device sys I/F, created once it's registered: 114|thermal_zone[0-*]: 115 |-----type: Type of the thermal zone 116 |-----temp: Current temperature 117 |-----mode: Working mode of the thermal zone 118 |-----trip_point_[0-*]_temp: Trip point temperature 119 |-----trip_point_[0-*]_type: Trip point type 120 121Thermal cooling device sys I/F, created once it's registered: 122|cooling_device[0-*]: 123 |-----type : Type of the cooling device(processor/fan/...) 124 |-----max_state: Maximum cooling state of the cooling device 125 |-----cur_state: Current cooling state of the cooling device 126 127 128These two dynamic attributes are created/removed in pairs. 129They represent the relationship between a thermal zone and its associated cooling device. 130They are created/removed for each 131thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful execution. 132 133|thermal_zone[0-*] 134 |-----cdev[0-*]: The [0-*]th cooling device in the current thermal zone 135 |-----cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with 136 137 138*************************** 139* Thermal zone attributes * 140*************************** 141 142type Strings which represent the thermal zone type. 143 This is given by thermal zone driver as part of registration. 144 Eg: "ACPI thermal zone" indicates it's a ACPI thermal device 145 RO 146 Required 147 148temp Current temperature as reported by thermal zone (sensor) 149 Unit: millidegree Celsius 150 RO 151 Required 152 153mode One of the predefined values in [kernel, user] 154 This file gives information about the algorithm 155 that is currently managing the thermal zone. 156 It can be either default kernel based algorithm 157 or user space application. 158 RW 159 Optional 160 kernel = Thermal management in kernel thermal zone driver. 161 user = Preventing kernel thermal zone driver actions upon 162 trip points so that user application can take full 163 charge of the thermal management. 164 165trip_point_[0-*]_temp The temperature above which trip point will be fired 166 Unit: millidegree Celsius 167 RO 168 Optional 169 170trip_point_[0-*]_type Strings which indicate the type of the trip point 171 E.g. it can be one of critical, hot, passive, 172 active[0-*] for ACPI thermal zone. 173 RO 174 Optional 175 176cdev[0-*] Sysfs link to the thermal cooling device node where the sys I/F 177 for cooling device throttling control represents. 178 RO 179 Optional 180 181cdev[0-*]_trip_point The trip point with which cdev[0-*] is associated in this thermal zone 182 -1 means the cooling device is not associated with any trip point. 183 RO 184 Optional 185 186****************************** 187* Cooling device attributes * 188****************************** 189 190type String which represents the type of device 191 eg: For generic ACPI: this should be "Fan", 192 "Processor" or "LCD" 193 eg. For memory controller device on intel_menlow platform: 194 this should be "Memory controller" 195 RO 196 Required 197 198max_state The maximum permissible cooling state of this cooling device. 199 RO 200 Required 201 202cur_state The current cooling state of this cooling device. 203 the value can any integer numbers between 0 and max_state, 204 cur_state == 0 means no cooling 205 cur_state == max_state means the maximum cooling. 206 RW 207 Required 208 2093. A simple implementation 210 211ACPI thermal zone may support multiple trip points like critical/hot/passive/active. 212If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time, 213it may register itself as a thermal_zone_device (thermal_zone1) with 4 trip points in all. 214It has one processor and one fan, which are both registered as thermal_cooling_device. 215If the processor is listed in _PSL method, and the fan is listed in _AL0 method, 216the sys I/F structure will be built like this: 217 218/sys/class/thermal: 219 220|thermal_zone1: 221 |-----type: ACPI thermal zone 222 |-----temp: 37000 223 |-----mode: kernel 224 |-----trip_point_0_temp: 100000 225 |-----trip_point_0_type: critical 226 |-----trip_point_1_temp: 80000 227 |-----trip_point_1_type: passive 228 |-----trip_point_2_temp: 70000 229 |-----trip_point_2_type: active0 230 |-----trip_point_3_temp: 60000 231 |-----trip_point_3_type: active1 232 |-----cdev0: --->/sys/class/thermal/cooling_device0 233 |-----cdev0_trip_point: 1 /* cdev0 can be used for passive */ 234 |-----cdev1: --->/sys/class/thermal/cooling_device3 235 |-----cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ 236 237|cooling_device0: 238 |-----type: Processor 239 |-----max_state: 8 240 |-----cur_state: 0 241 242|cooling_device3: 243 |-----type: Fan 244 |-----max_state: 2 245 |-----cur_state: 0