Linux kernel mirror (for testing)
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1# SPDX-License-Identifier: GPL-2.0-only
2#
3# Generic thermal drivers configuration
4#
5
6menuconfig THERMAL
7 bool "Thermal drivers"
8 help
9 Thermal drivers offer a generic mechanism for
10 thermal management. Usually it's made up of one or more thermal
11 zones and cooling devices.
12 Each thermal zone contains its own temperature, trip points,
13 and cooling devices.
14 All platforms with ACPI or Open Firmware thermal support can use
15 this driver.
16 If you want this support, you should say Y here.
17
18if THERMAL
19
20config THERMAL_NETLINK
21 bool "Thermal netlink management"
22 depends on NET
23 help
24 The thermal framework has a netlink interface to do thermal
25 zones discovery, temperature readings and events such as
26 trip point crossed, cooling device update or governor
27 change. It is recommended to enable the feature.
28
29config THERMAL_STATISTICS
30 bool "Thermal state transition statistics"
31 help
32 Export thermal state transition statistics information through sysfs.
33
34 If in doubt, say N.
35
36config THERMAL_DEBUGFS
37 bool "Thermal subsystem debug support"
38 depends on DEBUG_FS
39 help
40 Say Y to allow the thermal subsystem to collect diagnostic
41 information that can be accessed via debugfs.
42
43config THERMAL_CORE_TESTING
44 tristate "Thermal core testing facility"
45 depends on DEBUG_FS
46 help
47 Say Y to add a debugfs-based thermal core testing facility.
48 It allows test thermal zones to be created and populated
49 with trip points in order to exercise the thermal core
50 functionality in a controlled way.
51
52config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
53 int "Emergency poweroff delay in milli-seconds"
54 default 0
55 help
56 Thermal subsystem will issue a graceful shutdown when
57 critical temperatures are reached using orderly_poweroff(). In
58 case of failure of an orderly_poweroff(), the thermal emergency
59 poweroff kicks in after a delay has elapsed and shuts down the system.
60 This config is number of milliseconds to delay before emergency
61 poweroff kicks in. Similarly to the critical trip point,
62 the delay should be carefully profiled so as to give adequate
63 time for orderly_poweroff() to finish on regular execution.
64 If set to 0 emergency poweroff will not be supported.
65
66 In doubt, leave as 0.
67
68config THERMAL_HWMON
69 bool
70 prompt "Expose thermal sensors as hwmon device"
71 depends on HWMON=y || HWMON=THERMAL
72 default y
73 help
74 In case a sensor is registered with the thermal
75 framework, this option will also register it
76 as a hwmon. The sensor will then have the common
77 hwmon sysfs interface.
78
79 Say 'Y' here if you want all thermal sensors to
80 have hwmon sysfs interface too.
81
82config THERMAL_OF
83 bool
84 prompt "APIs to parse thermal data out of device tree"
85 depends on OF
86 default y
87 help
88 This options provides helpers to add the support to
89 read and parse thermal data definitions out of the
90 device tree blob.
91
92 Say 'Y' here if you need to build thermal infrastructure
93 based on device tree.
94
95choice
96 prompt "Default Thermal governor"
97 default THERMAL_DEFAULT_GOV_STEP_WISE
98 help
99 This option sets which thermal governor shall be loaded at
100 startup. If in doubt, select 'step_wise'.
101
102config THERMAL_DEFAULT_GOV_STEP_WISE
103 bool "step_wise"
104 select THERMAL_GOV_STEP_WISE
105 help
106 Use the step_wise governor as default. This throttles the
107 devices one step at a time.
108
109config THERMAL_DEFAULT_GOV_FAIR_SHARE
110 bool "fair_share"
111 select THERMAL_GOV_FAIR_SHARE
112 help
113 Use the fair_share governor as default. This throttles the
114 devices based on their 'contribution' to a zone. The
115 contribution should be provided through platform data.
116
117config THERMAL_DEFAULT_GOV_USER_SPACE
118 bool "user_space"
119 select THERMAL_GOV_USER_SPACE
120 help
121 The Userspace governor allows to get trip point crossed
122 notification from the kernel via uevents. It is recommended
123 to use the netlink interface instead which gives richer
124 information about the thermal framework events.
125
126config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
127 bool "power_allocator"
128 depends on THERMAL_GOV_POWER_ALLOCATOR
129 help
130 Select this if you want to control temperature based on
131 system and device power allocation. This governor can only
132 operate on cooling devices that implement the power API.
133
134config THERMAL_DEFAULT_GOV_BANG_BANG
135 bool "bang_bang"
136 depends on THERMAL_GOV_BANG_BANG
137 help
138 Use the bang_bang governor as default. This throttles the
139 devices one step at the time, taking into account the trip
140 point hysteresis.
141
142endchoice
143
144config THERMAL_GOV_FAIR_SHARE
145 bool "Fair-share thermal governor"
146 help
147 Enable this to manage platform thermals using fair-share governor.
148
149config THERMAL_GOV_STEP_WISE
150 bool "Step_wise thermal governor"
151 help
152 Enable this to manage platform thermals using a simple linear
153 governor.
154
155config THERMAL_GOV_BANG_BANG
156 bool "Bang Bang thermal governor"
157 default n
158 help
159 Enable this to manage platform thermals using bang bang governor.
160
161 Say 'Y' here if you want to use two point temperature regulation
162 used for fans without throttling. Some fan drivers depend on this
163 governor to be enabled (e.g. acerhdf).
164
165config THERMAL_GOV_USER_SPACE
166 bool "User_space thermal governor"
167 help
168 Enable this to let the user space manage the platform thermals.
169
170config THERMAL_GOV_POWER_ALLOCATOR
171 bool "Power allocator thermal governor"
172 depends on ENERGY_MODEL
173 help
174 Enable this to manage platform thermals by dynamically
175 allocating and limiting power to devices.
176
177config CPU_THERMAL
178 bool "Generic cpu cooling support"
179 depends on THERMAL_OF
180 help
181 Enable the CPU cooling features. If the system has no active
182 cooling device available, this option allows to use the CPU
183 as a cooling device.
184
185if CPU_THERMAL
186
187config CPU_FREQ_THERMAL
188 bool "CPU frequency cooling device"
189 depends on CPU_FREQ
190 default y
191 help
192 This implements the generic cpu cooling mechanism through frequency
193 reduction. An ACPI version of this already exists
194 (drivers/acpi/processor_thermal.c).
195 This will be useful for platforms using the generic thermal interface
196 and not the ACPI interface.
197
198config CPU_IDLE_THERMAL
199 bool "CPU idle cooling device"
200 depends on IDLE_INJECT
201 help
202 This implements the CPU cooling mechanism through
203 idle injection. This will throttle the CPU by injecting
204 idle cycle.
205endif
206
207config DEVFREQ_THERMAL
208 bool "Generic device cooling support"
209 depends on PM_DEVFREQ
210 depends on PM_OPP
211 help
212 This implements the generic devfreq cooling mechanism through
213 frequency reduction for devices using devfreq.
214
215 This will throttle the device by limiting the maximum allowed DVFS
216 frequency corresponding to the cooling level.
217
218 In order to use the power extensions of the cooling device,
219 devfreq should use the simple_ondemand governor.
220
221 If you want this support, you should say Y here.
222
223config PCIE_THERMAL
224 bool "PCIe cooling support"
225 depends on PCIEPORTBUS
226 help
227 This implements PCIe cooling mechanism through bandwidth reduction
228 for PCIe devices.
229
230 If you want this support, you should say Y here.
231
232config THERMAL_EMULATION
233 bool "Thermal emulation mode support"
234 help
235 Enable this option to make a emul_temp sysfs node in thermal zone
236 directory to support temperature emulation. With emulation sysfs node,
237 user can manually input temperature and test the different trip
238 threshold behaviour for simulation purpose.
239
240 WARNING: Be careful while enabling this option on production systems,
241 because userland can easily disable the thermal policy by simply
242 flooding this sysfs node with low temperature values.
243
244config THERMAL_MMIO
245 tristate "Generic Thermal MMIO driver"
246 depends on OF
247 depends on HAS_IOMEM
248 help
249 This option enables the generic thermal MMIO driver that will use
250 memory-mapped reads to get the temperature. Any HW/System that
251 allows temperature reading by a single memory-mapped reading, be it
252 register or shared memory, is a potential candidate to work with this
253 driver.
254
255config HISI_THERMAL
256 tristate "Hisilicon thermal driver"
257 depends on ARCH_HISI || COMPILE_TEST
258 depends on HAS_IOMEM
259 depends on OF
260 default ARCH_HISI
261 help
262 Enable this to plug hisilicon's thermal sensor driver into the Linux
263 thermal framework. cpufreq is used as the cooling device to throttle
264 CPUs when the passive trip is crossed.
265
266config IMX_THERMAL
267 tristate "Temperature sensor driver for Freescale i.MX SoCs"
268 depends on ARCH_MXC || COMPILE_TEST
269 depends on NVMEM || !NVMEM
270 depends on MFD_SYSCON
271 depends on OF
272 help
273 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
274 It supports one critical trip point and one passive trip point. The
275 cpufreq is used as the cooling device to throttle CPUs when the
276 passive trip is crossed.
277
278config IMX_SC_THERMAL
279 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
280 depends on IMX_SCU
281 depends on OF
282 help
283 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
284 system controller inside, Linux kernel has to communicate with system
285 controller via MU (message unit) IPC to get temperature from thermal
286 sensor. It supports one critical trip point and one
287 passive trip point for each thermal sensor.
288
289config IMX8MM_THERMAL
290 tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
291 depends on ARCH_MXC || COMPILE_TEST
292 depends on OF
293 help
294 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
295 It supports one critical trip point and one passive trip point. The
296 cpufreq is used as the cooling device to throttle CPUs when the passive
297 trip is crossed.
298
299config IMX91_THERMAL
300 tristate "Temperature sensor driver for NXP i.MX91 SoC"
301 depends on ARCH_MXC || COMPILE_TEST
302 depends on OF
303 help
304 Include one sensor and six comparators. Each of them compares the
305 temperature value (from the sensor) against the programmable
306 threshold values. The direction of the comparison is configurable
307 (greater / lesser than).
308
309config K3_THERMAL
310 tristate "Texas Instruments K3 thermal support"
311 depends on ARCH_K3 || COMPILE_TEST
312 help
313 If you say yes here you get thermal support for the Texas Instruments
314 K3 SoC family. The current chip supported is:
315 - AM654
316
317 This includes temperature reading functionality.
318
319config MAX77620_THERMAL
320 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
321 depends on MFD_MAX77620
322 depends on OF
323 help
324 Support for die junction temperature warning alarm for Maxim
325 Semiconductor PMIC MAX77620 device. Device generates two alarm
326 interrupts when PMIC die temperature cross the threshold of
327 120 degC and 140 degC.
328
329config QORIQ_THERMAL
330 tristate "QorIQ Thermal Monitoring Unit"
331 depends on THERMAL_OF && HAS_IOMEM
332 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
333 select REGMAP_MMIO
334 help
335 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
336 It supports one critical trip point and one passive trip point. The
337 cpufreq is used as the cooling device to throttle CPUs when the
338 passive trip is crossed.
339
340config AIROHA_THERMAL
341 tristate "Airoha thermal sensor driver"
342 depends on ARCH_AIROHA || COMPILE_TEST
343 depends on MFD_SYSCON
344 depends on OF
345 help
346 Enable this to plug the Airoha thermal sensor driver into the Linux
347 thermal framework.
348
349config SPEAR_THERMAL
350 tristate "SPEAr thermal sensor driver"
351 depends on PLAT_SPEAR || COMPILE_TEST
352 depends on HAS_IOMEM
353 depends on OF
354 help
355 Enable this to plug the SPEAr thermal sensor driver into the Linux
356 thermal framework.
357
358config SUN8I_THERMAL
359 tristate "Allwinner sun8i thermal driver"
360 depends on ARCH_SUNXI || COMPILE_TEST
361 depends on HAS_IOMEM
362 depends on NVMEM
363 depends on OF
364 depends on RESET_CONTROLLER
365 help
366 Support for the sun8i thermal sensor driver into the Linux thermal
367 framework.
368
369 To compile this driver as a module, choose M here: the
370 module will be called sun8i-thermal.
371
372config ROCKCHIP_THERMAL
373 tristate "Rockchip thermal driver"
374 depends on ARCH_ROCKCHIP || COMPILE_TEST
375 depends on RESET_CONTROLLER
376 depends on HAS_IOMEM
377 help
378 Rockchip thermal driver provides support for Temperature sensor
379 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
380 trip point. Cpufreq is used as the cooling device and will throttle
381 CPUs when the Temperature crosses the passive trip point.
382
383config KIRKWOOD_THERMAL
384 tristate "Temperature sensor on Marvell Kirkwood SoCs"
385 depends on MACH_KIRKWOOD || COMPILE_TEST
386 depends on HAS_IOMEM
387 depends on OF
388 help
389 Support for the Kirkwood thermal sensor driver into the Linux thermal
390 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
391
392config DOVE_THERMAL
393 tristate "Temperature sensor on Marvell Dove SoCs"
394 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
395 depends on HAS_IOMEM
396 depends on OF
397 help
398 Support for the Dove thermal sensor driver in the Linux thermal
399 framework.
400
401config DB8500_THERMAL
402 tristate "DB8500 thermal management"
403 depends on MFD_DB8500_PRCMU && OF
404 default y
405 help
406 Adds DB8500 thermal management implementation according to the thermal
407 management framework. A thermal zone with several trip points will be
408 created. Cooling devices can be bound to the trip points to cool this
409 thermal zone if trip points reached.
410
411config ARMADA_THERMAL
412 tristate "Marvell EBU Armada SoCs thermal management"
413 depends on ARCH_MVEBU || COMPILE_TEST
414 depends on HAS_IOMEM
415 depends on OF
416 help
417 Enable this option if you want to have support for thermal management
418 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
419
420config DA9062_THERMAL
421 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
422 depends on MFD_DA9062 || COMPILE_TEST
423 depends on OF
424 help
425 Enable this for the Dialog Semiconductor thermal sensor driver.
426 This will report PMIC junction over-temperature for one thermal trip
427 zone.
428 Compatible with the DA9062 and DA9061 PMICs.
429
430menu "Mediatek thermal drivers"
431depends on ARCH_MEDIATEK || COMPILE_TEST
432source "drivers/thermal/mediatek/Kconfig"
433endmenu
434
435config AMLOGIC_THERMAL
436 tristate "Amlogic Thermal Support"
437 default ARCH_MESON
438 depends on OF && ARCH_MESON
439 help
440 If you say yes here you get support for Amlogic Thermal
441 for G12 SoC Family.
442
443 This driver can also be built as a module. If so, the module will
444 be called amlogic_thermal.
445
446menu "Intel thermal drivers"
447depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
448source "drivers/thermal/intel/Kconfig"
449endmenu
450
451menu "Broadcom thermal drivers"
452depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
453 COMPILE_TEST
454source "drivers/thermal/broadcom/Kconfig"
455endmenu
456
457menu "Texas Instruments thermal drivers"
458depends on ARCH_HAS_BANDGAP || COMPILE_TEST
459depends on HAS_IOMEM
460source "drivers/thermal/ti-soc-thermal/Kconfig"
461endmenu
462
463menu "Samsung thermal drivers"
464depends on ARCH_EXYNOS || COMPILE_TEST
465source "drivers/thermal/samsung/Kconfig"
466endmenu
467
468menu "STMicroelectronics thermal drivers"
469depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF
470source "drivers/thermal/st/Kconfig"
471endmenu
472
473source "drivers/thermal/renesas/Kconfig"
474
475source "drivers/thermal/tegra/Kconfig"
476
477config GENERIC_ADC_THERMAL
478 tristate "Generic ADC based thermal sensor"
479 depends on IIO
480 help
481 This enabled a thermal sysfs driver for the temperature sensor
482 which is connected to the General Purpose ADC. The ADC channel
483 is read via IIO framework and the channel information is provided
484 to this driver. This driver reports the temperature by reading ADC
485 channel and converts it to temperature based on lookup table.
486
487menu "Qualcomm thermal drivers"
488depends on (ARCH_QCOM && OF) || COMPILE_TEST
489source "drivers/thermal/qcom/Kconfig"
490endmenu
491
492config UNIPHIER_THERMAL
493 tristate "Socionext UniPhier thermal driver"
494 depends on ARCH_UNIPHIER || COMPILE_TEST
495 depends on THERMAL_OF && MFD_SYSCON
496 help
497 Enable this to plug in UniPhier on-chip PVT thermal driver into the
498 thermal framework. The driver supports CPU thermal zone temperature
499 reporting and a couple of trip points.
500
501config SPRD_THERMAL
502 tristate "Temperature sensor on Spreadtrum SoCs"
503 depends on ARCH_SPRD || COMPILE_TEST
504 help
505 Support for the Spreadtrum thermal sensor driver in the Linux thermal
506 framework.
507
508config KHADAS_MCU_FAN_THERMAL
509 tristate "Khadas MCU controller FAN cooling support"
510 depends on OF
511 depends on MFD_KHADAS_MCU
512 select MFD_CORE
513 select REGMAP
514 help
515 If you say yes here you get support for the FAN controlled
516 by the Microcontroller found on the Khadas VIM boards.
517
518config LOONGSON2_THERMAL
519 tristate "Loongson-2 SoC series thermal driver"
520 depends on LOONGARCH || COMPILE_TEST
521 depends on OF
522 help
523 Support for Thermal driver found on Loongson-2 SoC series platforms.
524 The thermal driver realizes get_temp and set_trips function, which
525 are used to obtain the temperature of the current node and set the
526 temperature range to trigger the interrupt. When the input temperature
527 is higher than the high temperature threshold or lower than the low
528 temperature threshold, the interrupt will occur.
529
530endif